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Keynote Speakers

Jitesh Jain

Ritesh Jain

VP, Data Platforms Group (DPG), Intel Corporation

Ritesh Jain is a Sr. Director in the Data Platforms Group and leads the Datacenter Component Engineering Division at Intel Corporation. His division is responsible for the silicon packaging solutions, power integrity & power delivery, mechanical & thermal engineering solutions in support of the Data Platforms Group’s product roadmap which include CPUs, GPUs and AI accelerators.

Ritesh has been leading the engineering development of server packages and its collateral functions for the majority of his 18 years Intel career. He joined Intel’s server group as a package design engineer in 2001 and has since held various technical leadership and management positions in the group. Before joining Intel, Ritesh designed IC packages for smart connectors in the automotive industry, working at Delphi Automotive.

Ritesh earned his master’s degree in Electronic Packaging from the University of Maryland in College Park and his bachelor’s degree in Mechanical Engineering from IIT Madras in Chennai, India.

 

Suresh Ramalingam

Dr. Suresh Ramalingam

Xilinx Fellow (VP)

Dr. Suresh Ramalingam graduated in 1994 with a Ph.D. in Chemical Engineering from Massachusetts Institute of Technology, Cambridge. He holds 32 US Patents, 2013 SEMI Award, Ross Freeman Award for Technical Innovation, ECTC 2011 Conference Best Paper Award, IMAPS 2013 and 2014 Conference Best Paper Awards for 2.5D/3D and book chapter on 3D Integration in VLSI Circuits.

He started his career at Intel developing Organic Flip Chip Technology for Micro-processors which was implemented on Pentium II (Intel’s first flip chip product) in 1997. As one of the co-founders and Director of Packaging Materials at Scion Photonics he helped develop DWDM modules used by major communication companies. JDS Uniphase acquired Scion Photonics in 2002.

As a Xilinx Fellow, he currently manages Advanced Packaging Interconnect Technology Development including TSV/3D for Xilinx FPGA products. Thermal Enablement and Board/System Level is a key focus area to push the power/performance envelope under the leadership of Dr. Gamal Refai-Ahmed and happy to be a partner in crime supporting the necessary technology pieces.

 

Scott Miller

Dr. Scott Miller

Director of Technology, NextFlex

Topic: Flexible Electronics

Dr. Scott Miller is the Director of Technology at NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute. Scott is responsible for the portfolio of technical projects funded by NextFlex, runs its Technical Council and Technical Working Groups, leads the development of FHE industry road mapping, oversees initiatives within the Institute, and builds and maintains relationships with government and industry partners.

Scott earned his Ph.D. in Chemical Engineering from Princeton University, where he did research on large area electronics manufacturing based on printing processes. Prior to joining NextFlex, Scott led materials R&D groups at GE Global Research supporting a diverse range of businesses. He has worked in areas including printed, flexible, and hybrid electronics; wearable devices; additive manufacturing; and bioprinting and bio fabrication.