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Aerospace Electronics

Moderator: Dr. Ben Leever, US AFRL

Flexible and printed electronics are providing new opportunities for aerospace electronics in terms of both innovative packaging solutions as well as unique form factors. Panelists will discuss packaging strategies to enable the integration of thin die as well as higher density electronic packages. They will also describe how flexible & conformal electronics (such as photovoltaics, antennas, and interconnects) deliver reduced weight and/or new capabilities for applications such as UAVs, satellites, and wearable sensors.


  • Mary Herndon, Raytheon
  • Steve Gonya, Lockheed Martin
  • John Rogers, Boeing
  • David Shaddock, GE


Printing Technologies for Additive Electronics

Moderator: Pradeep Lall, MacFarlane Endowed Distinguished Professor and Director, Auburn University

Traditionally, electronics manufacturing has involved the use of subtractive processes requiring the use of plating, wet-etching, and masks. Additive processes hold the promise of a shorter time to first-prototype through the use of digitally-driven design and in some cases the added ability to migrate to non-planar structures. A number of processes have emerged for high volume production of electronics including aerosol-jet printing, ink-jet printing, direct-write and stencil printing. Each of the processes offers advantages with a balance of trade-offs in comparison with traditional methods. In this session, the panelists will provide an overview of each of the technologies and engage in discussion on the opportunities and the technology gaps related to each of the additive technologies.


  • Dave Ramahi, Optomec
  • Ken Church, nScrypt
  • Don Veri, SUSS
  • Doug Schardt, Komori


HIR Challenges and opportunities

Chair: Dr Gamal Refai-Ahmed, Xilinx Fellow
Co-Chair: Prof Leila Choobineh, Professor Sunypoly


  • Prof Bahgat Sammakia, Vice President Binghamton University
  • Prof Amr Helmy, Professor University of Toronto
  • Dr. Ravi Mahajan, Intel Fellow
  • Dr. Suresh Ramalingam, Xilinx Fellow

This panel will be addressing the challenges of the current and future HIR challenges. This is a complete dynamic panel. Panelists will be in a complete dialog with each other in the following areas:

  • Can acadamia produce a valuable proposition to the industry
    • Each academic panelist will give 1-2 examples
  • Can Foundry provide a meaning information (i.e. manufacturing process, materials, assemble, analysis) to enable holistic Heterogonous Integration from Si supplier/OSAT/
    • Each industrial panelist will give 1-2 examples
  • Do we need to have a new definition of Life time in Heterogonous Integration era. h (i.e. Fit Budget should be done based on the end customer applications, Co-planarity should be revised in JEDEC, how can we connect TC (C/B/G..), Electro migration…. Component to system)
    • Each Panelist will give its view
  • What are the gaps from Panelists point view on the current offering road maps from HIR


Women in Engineering

Tuesday, October 27, 2020

Chair: Leila Choobineh


  • Jelena Srebric, Professor, Acting Associate Dean of Research, A. James Clark School of Engineering, University of Maryland
  • Anna M Prakash, Intel Corporation
  • Nesrin Ozalp, Professor of Mechanical Engineering and Department Chair, Purdue University Northwest
  • Elham Maghsoudi, NASA Jet Propulsion Laboratory
  • Shelby Nelson, Mosaic Micro


Mobile, IOT and Computer Device Applications Panel: Thermal and Mechanical Challenges

Victor Chiriac

Moderator: Dr. Victor Chiriac, Managing Leader of Global Cooling Technology Group, ASME Fellow

Summary: The emergence of 5G will help power a significant rise in mobile communication, IoT technology, providing the infrastructure needed to carry huge amounts of data, allowing for a smarter and more connected world – enabling Smart Cities, connected roads, advanced transportation (Self-driving cars), AR/VR, AI robotics, Digital healthcare, smart Sports and many other. Everything requires higher performance, more data, faster processors! Heterogeneous Computing involves the central processing units (CPUs), the graphics processing units (GPUs), high speed interconnects and other elements that push forward the computing industry. A panel of experts will share their vision on the future of small to large electronics thermal management and other advanced system level thermo-mechanical challenges and solutions of the future.


  • Dr. Ravi Mahajan (Intel Corporation, Engineering Fellow)
  • Mr. Hiroyuki Ryoson (Dexerials, Executive Chief Engineer
  • Professor John Thome (ex-EPFL, CTO of GCTG)
  • Dr. Mark Earnshaw (Nokia Bell Labs, Group Lead/Director)
  • Professor Amy Marconnet (Purdue)
  • Don Le (Qualcomm, Principal Manager


Title: Packaging Architectures for Heterogeneous Integration: Thermal/Thermo-Mechanical Implications
Dr. Ravi Mahajan

Ravi Majajan

Biography: Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi joined Intel in 1992 after earning Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel's EMIB technology. His early insights have also led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques used for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award For Excellence. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has been long associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE.

Abstract: In this presentation, I will set the context for why Heterogeneous Integration using advanced packaging matters and briefly describe the various advanced packaging architectures in development. These architectures open up many challenges in thermal management and in ensuring robustness under thermo-mechanical stresses experienced during manufacturing and application conditions. I will describe how these challenges also offer opportunities for the packaging engineers in the fields of thermal management, reliability and thermo-mechanical analysis and experimentation.


Title: Packaging High Thermal Conductive EMI Shielding TIM
Mr. Hiroyuki Ryoson

Hiroyuki Ryoson

Biography: Hiroyuki Ryoson finished the master’s degree in mechanical engineering at Kyoto University in 1990, and he joined Sony Corporation in 1990 and researched mainly in mechanical field. He is now an executive chief engineer in Dexerials Corporation (former Sony Chemical), and managing every theme in technology side in this company.

Abstract: In order to support 5G communication technology, it is necessary to perform large-scale information processing instantly, and it is expected that the heat density of LSIs will increase. At this time, heat dissipation from ICs such as CPU or GPU is a huge problem. Generally, the method of releasing heat from the IC to the heat sink is often used. However, since the heat sink is generally made of metal, the heat sink itself acts as an antenna and there is a risk that it emits an electromagnetic field due to electromagnetic coupling between the heatsink and the IC. In order to suppress such a phenomenon, a new type TIM In which carbon fibers are oriented in thickness direction is developed which has two performances in one material, which performances are EMI shielding performance and high thermal conductivity. And this material can achieve a high thermal conductivity of 20 W/mK.


Title: Cooling of Mobile and Portable Electronics with Pulsating Heat Pipes
Professor John R. Thome

Professor John R. Thome

Biography: Technical Director of Global Cooling Technology Group in Phoenix, AZ developing pulsating heat pipe technologies for the mobile electronics market as well as JJ Cooling Innovation in Lausanne, Switzerland, a micro-two-phase cooling technology development company for numerous other industries. Has 20+ years of experience with development of micro-two-phase cooling systems for electronics (pumped systems, thermosyphons and pulsating heat pipes and high-fidelity simulators for them). Is the author of five books and is editor-in-chief of the Encyclopedia of Two-Phase Heat Transfer and Flow (16 volumes). He received the 2017 Nusselt-Reynolds Prize, the 2019 IEEE ITHERM Award and the 2019 ASME InterPACK Medal, the ASME Heat Transfer Division's Journal of Heat Transfer Best Paper Award in 1998, the UK’s Institute of Refrigeration J.E. Hall Gold Medal in 2008, the 2010 ASME Heat Transfer Memorial Award, among others.

Abstract: Pulsating heat pipes (PHPs) are an emerging two-phase cooling technology for cooling of mobile and portable electronics. A PHP consists of a serpentine channel that runs back-and-forth from the hot end (cooling electronics) to the cold end within a thin plate. The two-phase flow inside the serpentine is designed to be inherently unstable, with bubbles growing in the evaporator zone and condensing in the cold zone, and by transporting latent and sensible heat from the hot end to the cold end is able to cool devices with moderate up to high heat loads with a very thin shape factor. PHPs are particularly effective as they can operate in any orientation and can transport heat to large cooling surface areas. Innovative PHP studies of Global Cooling Technology Group and related thermal performance results will be presented together with prospects for future applications.


Title: Thermal Challenges in the New 5G End-End Network Era
Dr. Mark Earnshaw

Mark Earnshaw

Biography: Dr. Mark and optical transceivers. His recent work has focused on developing a hybrid photonics integration platform for extremely efficient optical communications and sensing applications. Mark Earnshaw has received the Bell Labs President’s award and Bell Labs & CTO award and the 2018 Nokia US Top Inventor Recognition Award.

Abstract: The new 5G era will impact all aspects of communication networks including not just radio antennas but the access network and edge data centers which will create seamless connectivity to enable the new era of industrial automation. The new services will drive capacity growth both directly but also indirectly in order to achieve the new ultra-low latency and ultra-high reliability demands. Massive MIMO antenna arrays have clear need for advances in efficient, lightweight cooling solutions. Optical transceivers interconnecting antennas to remote radio access network equipment and edge cloud data centers are reaching extremely high-power densities. The harsh operating environments in which networking equipment is often deployed require novel device and system level reliability solutions for mission critical end-to-end connected services to be viable.


Title: Engineering Materials for Thermal Challenges
Professor Amy Marconnet

Professor Amy Marconnet

Biography: Amy Marconnet is an associate professor of Mechanical Engineering at Purdue. Research in the Marconnet Thermal and Energy Conversion (MTEC) Lab intersects heat transfer, energy conversion, and materials science to enable advances in technologies where energy conversion and thermal transport are key factors in performance. Prof. Marconnet has developed an interdisciplinary research program to evaluate, understand, and control the physical mechanisms governing the multi-functional properties of materials, machines, and systems. Recently, Dr. Marconnet won the 2020 Bergles-Rohsenow Young Investigator Award in Heat Transfer from ASME.

Abstract: Mobile platforms, IoT, and compute devices with limited heat dissipation pathways are becoming ubiquitous while requiring integration of dissimilar materials and components with a high density of interfaces and placing additional constraints on device performance. Open challenges exist in optimizing and tuning the thermal transport within the multi-scale materials in these heterogeneous systems, while meeting constraints on mechanical properties and device performance. Ultimately, efficient, thermally informed engineering is needed to translate research into technology and requires integrated modeling, experiments, and materials development.


Title: Thermal Design Challenges & Possible Solutions in 5G Mobile/Wireless Devices
Don Le

Don Le

Biography: Don Le is a 25-year veteran of the semiconductor/computer product development industry. His work included thermal solution development for CPU, GPU, and mobile SOC from silicon/package to system levels at IBM, Intel, Nvidia, and Qualcomm.

Abstract: As 5G technology becomes more prevalent on various mobile wireless devices along with increasing demand for higher performance, the author will outline some of the challenges and thermal solution techniques that can be employed to optimize the performance of the products.



Advances in Wearable/Wireless Flexible Electronics: Thermal and Mechanical Challenges and Opportunities

Victor Chiriac

Moderator: Dr. Victor Chiriac, Managing Leader of Global Cooling Technology Group, ASME Fellow

Summary: The emergence of 5G will help power a significant rise in wearable/mobile/wireless communication, providing the infrastructure needed to carry huge amounts of data, allowing for a smarter and more connected world. A panel of experts from diverse industrial sectors and academia will share their vision on the future of small to large wearable/wireless flexible electronics thermal management and other advanced system-level thermo-mechanical challenges and solutions of the future.



  • Dr. Kinzy Jones, Jr. (Magic Leap, VP Engineering)
  • Professor YC Lee (UC Boulder, CEO of Kelvin Tech)
  • Matthew Dalton (WP-AFRL, Engineering Lead)
  • Prof Amy Marconnet, (Purdue)
  • Dr. Luca Amalfi (Nokia/Bell Labs, Sr Engineer)


Title: User-Centric Modeling in Spatial Computing
Kinzy Jones, PhD

Kinzy Jones

Biography: Dr. Jones' background is mathematical modeling including materials, fluids, and structures. His work, and that of his team, strives to use simulation, material analysis, and high fidelity testing to predict product failures and identify design improvements, thus reducing cost from unnecessary prototype builds and field failures, reducing time to market, and improving KPIs. He has been at Magic Leap for six years creating and managing the Advanced Mechanics and Materials group and serving as a Magic Leap Fellow. Previously, he was a Distinguished Member of the Technical Staff at Motorola and Vice President of Consulting Services at Amoeba Technologies. He received his Ph.D. from the University of California, Berkeley in Materials Science and Engineering in 1999.

Abstract: Spatial computing facilitates mixed reality experiences and is poised to become the world’s next computing platform. This will enable innovative forms of entertainment, productivity, education, communication, and commerce. This new platform will radically change human interaction with technology by blurring the lines between the physical and virtual worlds – making computer interaction richer, faster, and more enjoyable. The addition of 5G will further this merging, enabling virtual objects to 'live' in our physical environments just as physical objects do today. Achieving this grand vision requires overcoming many challenges. This talk focuses on moving from device- to human-centric metrics and results. Traditional device-centric key performance indicators (KPI) like temperature, stress, and displacement, are difficult to resolve in terms of user experience, potentially focusing engineering effort on parameters with limited impact. This talk presents two examples showing a user-based, rather than device-based, approach to spatial computing product development: human thermal comfort modeling, and the use of multiphysics to determine sensor performance.


Title: Flexible Thermal Ground Planes for Smartphones, Computers and Power Electronics
Dr. Y. C. Lee

Y.C. Lee

Biography: Dr. Y. C. Lee is the President and CEO of Kelvin Thermal and Professor of Mechanical Engineering at the University of Colorado Boulder. Dr. Lee received the ASME InterPACK Achievement Award in 2013. He was the Editor of ASME Journal of Electronic Packaging from 2015 to 2020.

Abstract: Flexible thermal ground planes (TGPs) are vapor chambers designed and manufactured using flexible circuit board technologies. The first TGP product is to be mass produced by 4Q in 2020. Our TGP is known for its outstanding features: thinnest configuration, large size, flexible, conformable, deformable, foldable, super isothermal, high heat flux and low cost. Kelvin Thermal is well positioned to provide leading thermal management solutions for smartphones, tablets, laptop computers, ARs/VRs, displays, electric vehicles with autonomous features, GaN-based power electronics, and edge and cloud computing. This brief presentation will illustrate some of the TGP products to be introduced in the near future: 0.150mm TGP, polymer TGP, folding TGP and high power TGP.


Title: SmartMedTech Prototype Wearable Devices for the USAF Aeromedical Mission
Matthew Dalton

Matthew Dalton

Biography: Matthew J. Dalton is a Research Chemist and Program Manager within the Soft Matter Materials Branch of the Materials and Manufacturing Directorate at the Air Force Research Laboratory. Executes the branch’s applied technology development portfolio developing and demonstrating advanced materials solutions for aerospace wearable technology for both the high performance flight environment and the aeromedical mission. Manages the Materials for Aeromedical Technology and Care Program developing low-cost physiological sensors for the En Route Care mission. Mr. Dalton obtained his BS in Chemistry from Wright State University and his MS in Materials Chemistry from the University of Illinois at Urbana-Champaign.

Abstract: The En Route Care (ERC) Aeromedical Evacuation (AE) system provides for the strategic military medical evacuation of patients and wounded warfighters. Vital to this mission is the pursuit of new methods for transporting patients with increased effectiveness and efficiency while dealing with the unique challenges of the aerospace transport environment: reduced barometric pressure and oxygen availability, increased accelerational and vibrational forces, ambient thermal instability, and a dry environment that may negatively impact patient health or device performance during transport. Reliable, wireless, wearable physiological monitoring technology can help the AE medical provider optimize patient care en-route through increased situational awareness, alerting, and decision support. Most commercial off-the-shelf (COTS) technology does not meet USAF or military requirements (JECETS, MIL-STD-810H) for operational use. Flexible electronic prototypes in development and challenges and opportunities will be discussed.


Title: Flexible, High Thermal Conductivity Materials
Professor Amy Marconnet

Amy Marconnet

Biography: Amy Marconnet is an associate professor of Mechanical Engineering at Purdue University. Research in the Marconnet Thermal and Energy Conversion (MTEC) Lab intersects heat transfer, energy conversion, and materials science to enable advances in technologies where energy conversion and thermal transport are key factors in performance. Prof. Marconnet has developed an interdisciplinary research program to evaluate, understand, and control the physical mechanisms governing the multifunctional properties of materials, machines, and systems. Recently, Dr. Marconnet won the 2020 Bergles-Rohsenow Young Investigator Award in Heat Transfer from ASME.

Abstract: The emergence of wearable and flexible electronics necessitates the development of flexible materials with tailored thermal/mechanical properties not naturally occurring. A particular challenge for wearable electronics is optimizing and tuning the thermal transport to dissipate heat to the environment without exceeding safety limits for human contact and while maintaining the mechanical flexibility for user comfort. Woven materials consisting of high thermal conductivity fibers have shown significant promise in meeting these multi-functional needs. From a filament to fabric perspective, we have developed new metrology tools to evaluate these systems and provide feedback as we engineering high thermal conductivity, flexible materials for wearable and flexible electronics.


Title: Mini-Pulsating Heat Pipes for Wearable and Flexible Electronics
Dr. Luca Amalfi

Luca Amalfi

Biography: Raffaele Luca Amalfi is a Member of Technical Staff and Lead Researcher at Nokia Bell Labs New Jersey, where he performs cutting-edge research in the field of thermal management of high-performance telecommunications and computing systems across multiple scales. He is the Principal Investigator on behalf of Nokia of America Corporation and Bell Labs for the Eurostars Project PCOOLDATA focused on the development of innovative cooling solutions for datacenters. His research activities include: macro-to-micro-scale heat and mass transfer, thermal-mechanical design of advanced heat exchangers, integrated opto-electronics thermal management; active and passive thermal solutions for electronics, power-electronics- and datacenter-cooling. He has received a Ph.D. in Energy Engineering from EPFL and he has authored more than 30 scientific publications.

Abstract: The world is entering the Fourth Industrial Revolution that is bringing together digital, physical, and biological systems, which will deeply transform economy and society. Demand for processing, transporting, and storing digital data is growing exponentially, and this will have profound implications on system design with the associated trend toward achieving greater device functionality per unit volume. Sensing and diagnostic wearable devices, as well as flexible electronics are seen as emerging products, allowing greater connectivity between humans and machines. However, these devices present many thermal and mechanical challenges. Embedded passive two-phase cooling represents a viable and attractive solution, as it provides high heat dissipations and uniform heat spreading coupled with small form factors. In this talk, I will discuss the benefits and opportunities of implementing mini-pulsating heat pipes to keep scaling and developing advanced wearable and flexible devices.