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Provided by ASME Logo The American Society of Mechanical Engineers


Dear Authors and Presenters,

Thank you again for your participation in the Virtual International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) which will be held on October 26-28, 2021. This year's conference will include all live content, including featured keynotes, panels, workshops, and tutorials.

Technical Presentations: Authors will pre-record and upload a 10-minute presentation of their work for OnDemand viewing within the conference platform. The presenter needs to be a lead author or co-author and be registered for the conference. At least one author needs to register at the full registration rate, not the student rate. Registrations will be closely monitored. The site will be open for video submission starting July 19, 2021. We will email you additional instructions for submitting the video of your presentation (format in .MP4 or .mov only), which will be due on July 30, 2021.

PowerPoint Slide Template:

You can find tips and guidance on recording here:

Thank you.