Advanced Packaging, Thermal Management, Die Stacking, Multichip Modules, Interconnect Technology, Substrate Technology, Through-Silicon Vias, Wafer Level Packaging (Fan-in, Fan-out), Panel Level Packaging, System in Package, Microsystems Integration, RF Packaging, Advanced Materials and Processes, Chip Package Interaction, Modeling, Characterization and Reliability for Integrated Devices, Electronic Materials, Underfills, Molding Compounds, Substrates, Dielectrics
Internet of Things
IoT Device Design and Fabrication, IoT Sensing, Flexible Substrates, Thermal and Mechanical Properties.
Flexible and Wearable Electronics
Fabrication, Printed Electronics, Substrate Materials, Thin-Die Handling, Hermetic Packaging, Interconnects, Sensors and Actuators, RF Resonators, Implantable Medical Devices, Microfluidic Systems, Biosystems and Biomedicine, Prognostics and Health Monitoring, Integration, Materials Interactions and Characterization, Reliability of Devices and Systems, Reliability Modeling and Simulation, Reliability Test Methods and Solder Joint Reliability.
Photonics and Optics
Photonics Packaging, Integrated Photonics, Optical Integration, Thermal and Mechanical Challenges for Optical Photonics Integration, Light Emitting Diodes and Laser Diodes: Thermal, Mechanical, Reliability and Integration Aspects.
Servers of the Future, Edge and Cloud Computing
Data Centers and Energy-Efficient Electronic Systems, Cloud Computing Hardware, Edge-to-Cloud Systems, Rack-Level Cooling, Thermal Interface Materials and Thermal Underfills, Fans and Pumps, Thermosyphons and Refrigeration, Exaflop Computing Systems, Memory, Connectors, Advanced Substrates, Novel Cooling Techniques and Heat Transport, Heat Exchangers, Device-to-System Level Packaging, Multiscale Thermal Modeling
Wide-Bandgap Semiconductor Packaging, Harsh Environment Sensors, High-Temperature Electronics, Interconnects, Novel Materials, Novel Devices, Thermal Management, Integrated Heat Sinks, Thermal Design and Modeling, High-Voltage Packaging, Reliability Modeling and Simulation, Package and Component Reliability and Prognostics, Interface/Interconnect Reliability.
Energy Conversion, and Storage
Energy Harvesting, Energy Storage, Thermoelectrics, Photovoltaics, Fuel Cells, Batteries, Integration in Systems, Safety, Thermal Management, Fast Charging, Diagnostics, Design, Manufacturing, Recycling.
Autonomous, Hybrid, and Electric Vehicles
Electronics for Vehicle Electrification, High-Temperature Sensors, RADAR, LIDAR, Advanced Driver Assistance System (ADAS) Electronics, MEMS Packaging, Control Systems, Electronic Materials, Nanosatellites, Unmanned Aerial Vehicle Electronics, Hybrid Packaging, Prognostic Health Monitoring, Vehicle Charging, Wireless Power Transfer, Electric Motors/Machines, Motor Control Sensing, Battery Management.