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Program

Program – Call for Papers

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. InterPACK is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The international nature of the meeting has been highly beneficial in promoting global interactions between Industry, Academia and National Labs. In addition to paper presentations and exhibits, InterPACK 2019 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a Joint Industry-Academia-National Lab poster session. Abstracts (<400 words) for papers, presentation-only, and poster contributions are solicited by January 30, 2019. Submissions are encouraged (but not limited to) the general track areas listed below.

Program Tracks and Descriptions

Heterogeneous Integration

Advanced Packaging, Thermal Management, Die Stacking, Multichip Modules, Interconnect Technology, Substrate Technology, Through-Silicon Vias, Wafer Level Packaging (Fan-in, Fan-out), Panel Level Packaging, System in Package, Microsystems Integration, RF Packaging, Advanced Materials and Processes, Chip Package Interaction, Modeling, Characterization and Reliability for Integrated Devices, Electronic Materials, Underfills, Molding Compounds, Substrates, Dielectrics

Internet of Things

IoT Device Design and Fabrication, IoT Sensing, Flexible Substrates, Thermal and Mechanical Properties.

Flexible and Wearable Electronics

Fabrication, Printed Electronics, Substrate Materials, Thin-Die Handling, Hermetic Packaging, Interconnects, Sensors and Actuators, RF Resonators, Implantable Medical Devices, Microfluidic Systems, Biosystems and Biomedicine, Prognostics and Health Monitoring, Integration, Materials Interactions and Characterization, Reliability of Devices and Systems, Reliability Modeling and Simulation, Reliability Test Methods and Solder Joint Reliability.

Photonics and Optics

Photonics Packaging, Integrated Photonics, Optical Integration, Thermal and Mechanical Challenges for Optical Photonics Integration, Light Emitting Diodes and Laser Diodes: Thermal, Mechanical, Reliability and Integration Aspects.

Servers of the Future, Edge and Cloud Computing

Data Centers and Energy-Efficient Electronic Systems, Cloud Computing Hardware, Edge-to-Cloud Systems, Rack-Level Cooling, Thermal Interface Materials and Thermal Underfills, Fans and Pumps, Thermosyphons and Refrigeration, Exaflop Computing Systems, Memory, Connectors, Advanced Substrates, Novel Cooling Techniques and Heat Transport, Heat Exchangers, Device-to-System Level Packaging, Multiscale Thermal Modeling

Power Electronics

Wide-Bandgap Semiconductor Packaging, Harsh Environment Sensors, High-Temperature Electronics, Interconnects, Novel Materials, Novel Devices, Thermal Management, Integrated Heat Sinks, Thermal Design and Modeling, High-Voltage Packaging, Reliability Modeling and Simulation, Package and Component Reliability and Prognostics, Interface/Interconnect Reliability.

Energy Conversion, and Storage

Energy Harvesting, Energy Storage, Thermoelectrics, Photovoltaics, Fuel Cells, Batteries, Integration in Systems, Safety, Thermal Management, Fast Charging, Diagnostics, Design, Manufacturing, Recycling.

Autonomous, Hybrid, and Electric Vehicles

Electronics for Vehicle Electrification, High-Temperature Sensors, RADAR, LIDAR, Advanced Driver Assistance System (ADAS) Electronics, MEMS Packaging, Control Systems, Electronic Materials, Nanosatellites, Unmanned Aerial Vehicle Electronics, Hybrid Packaging, Prognostic Health Monitoring, Vehicle Charging, Wireless Power Transfer, Electric Motors/Machines, Motor Control Sensing, Battery Management.