ASME will hold open help center calls to offer on the spot technical support for the new tool.
In addition to paper presentations and exhibits, InterPACK 2020 will include panel discussions, workshops, tutorials, keynotes and technology talks, and a poster session.
The deadline to submit abstracts for InterPACK2020 is February 6, 2020.
ASME is monitoring the Coronavirus (COVID-19) situation to ensure the health and safety of our meeting and conference participants, as well as our staff. We will also be monitoring the recommendations from the Centers for Disease Control and Prevention (CDC) and the World Health Organization (WHO) as the situation progresses.
As of this date, the conference is currently scheduled to take place. Please continue your work in the expectation that the conference will occur. All dates in the current Publications Schedule will be followed. Should it be determined that the conference may need to be postponed, cancelled, or held virtually instead of in-person for the health and safety of all, ASME has committed to offering the option of publishing the papers through our usual channels. Please note that the one author per paper registration requirement will still hold should the conference be held virtually, but the presentation requirement may be waived. Should this become necessary, virtual conference registration fees will be discounted from the regular conference fee. If postponed, ASME will work with the conference organizing committee to determine whether the papers will be published at the time of the scheduled conference or delayed until the rescheduled one.
If there are any changes to these plans, we will provide updates on this website. We understand that you will have questions, so please check back periodically. Thank you.
The next update to this information is scheduled next Wednesday.
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2020 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
- Track 1: Heterogeneous Integration: Micro-Systems with Diverse Functionality
- Track 2: Servers of the Future, Edge and Cloud Computing
- Track 3: Flexible and Wearable Electronics
- Track 4: Optics and Photonics
- Track 5: Power Electronics
- Track 6: Multiscale Energy Transport, Conversion, and Storage
- Track 7: Autonomous, Hybrid, and Electric Vehicles
- Track 8: Industry, National Laboratory, and Academia Posters
Submission of Full-Length Paper for Review
May 26, 2020
Author Paper Review Complete
June 15, 2020
Copyright Process Opens
June 19, 2020
Draft Paper Acceptance Notification (copyrights issued upon acceptance of draft)
June 19, 2020
Submission of Revised Papers
July 10, 2020
Acceptance of Revised Papers
July 15, 2020
Submission of Presentation Only Abstract
July 16, 2020
Author Notification of Presentation Only Abstract Acceptance
July 23, 2020
Copyright Submission Deadline
July 24, 2020
Submission of Final Paper
July 27, 2020