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InterPACK®
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
In-Person Event
Doubletree by Hilton San Diego Mission Valley, San Diego, CA
October 24–26, 2023

InterPACK 2023

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.

It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2022 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

InterPACK 2023 Tracks:

  • Heterogeneous Integration
  • Data Centers and Modular Edge Systems
  • Electronics Packaging
  • Power/RF Electronics and Photonics
  • Multiscale Thermal Transport and Energy Storage
  • Flexible, Wearable, and Printed Electronics
  • Transportation Systems, AI and Machine Learning
  • Interactive Presentations
  • Track 9: Panels, Tutorials, and Workshops

Important Dates

  • Feb
    27
    February 27, 2023
    Abstract Submission
  • Mar
    13
    March 13, 2023
    Notification of Abstract Acceptance
  • May
    15
    May 15, 2023
    Submission of Full-length Draft Paper for Review / Electronic Copyright Process Opens
  • Jun
    05
    June 05, 2023
    Paper Review Complete
  • Jun
    12
    June 12, 2023
    Paper Acceptance Notification
  • Jun
    19
    June 19, 2023
    Submission of Revised Paper for Review (if required)
  • Jun
    26
    June 26, 2023
    Author Notification of Acceptance of Revised Papers
  • Jul
    14
    July 14, 2023
    Submission of Copyright Form
  • Jul
    17
    July 17, 2023
    Final Paper Submission