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Provided by ASME Logo The American Society of Mechanical Engineers

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Hilton Anaheim, Anaheim, CA

Conference: October 27 – 29, 2020
Exhibition: October 27 – 29, 2020

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2020 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

 

InterPACK2020 Tracks:

  • Track 1: Heterogeneous Integration,
  • Track 2: Servers of the Future, Edge and Cloud Computing,
  • Track 3: Flexible and Wearable Electronics,
  • Track 4: Photonics and Optics,
  • Track 5: Power Electronics,
  • Track 6: Energy Conversion and Storage
  • Track, 7: Autonomous, Hybrid, and Electric Vehicles,
  • Track 8: Industry, National Laboratory, and Academia Posters

 

Important Dates

  • InterPACK 2020
    October 27, 2020
InterPACK® -117.91839290000001 33.8000919 Hilton Anaheim Anaheim, CA EE4C8B