InterPACK 2025
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2024 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
InterPACK 2025 Tracks:
- Heterogeneous Integration
- Data Centers and Modular Edge Systems
- Electronics Packaging
- Power/RF Electronics and Photonics
- Multiscale Thermal Transport and Energy Storage
- Flexible, Wearable, and Printed Electronics
- Transportation Systems, AI and Machine Learning
- Interactive Presentations
- Micro/Nano Mechatronics, Microelectromechanical Systems and their Applications to Internet of Things
- Mechatronics, Tribology, and Control of Information Storage Systems and Robotics
- Advanced Simulation in Science and Engineering
- Panels, Tutorials, and Workshops
View Track Descriptions
EPPD Collaboration with Information Storage and Processing Systems (ISPS) and Micromechatronics for Information and Precision Equipment (MIPE)
Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.
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