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Provided by ASME Logo The American Society of Mechanical Engineers

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Hyatt Regency Orange County, Garden Grove, CA

Conference: October 25 – 27, 2022

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Announcements

Abstract Submission has been extended to March 29, 2022

ASME will hold open help center calls to offer on the spot technical support for the web tool.

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2022 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

 

InterPACK 2022 Tracks:

  • Track 1: Heterogeneous Integrated Systems
  • Track 2: Data Centers, Servers of the Future, Edge and Cloud Computing
  • Track 3: Flexible, Wearable and Additively Printed Electronics
  • Track 4: Photonics and Optics
  • Track 5: Power Electronics
  • Track 6: Multi-scale Thermal Transport, Thermal Materials, and Energy Systems
  • Track 7: Harsh Environment Electronic Applications for Transportation Systems
  • Track 8: Reliability of Electronic Packages and Systems
  • Track 9: Digital Technologies in Microelectronics
  • Track 10: Interactive Presentations

Important Dates

  • Abstract Submission
    March 29, 2022
  • Submission of Full-Length Paper for Review
    May 20, 2022
  • Paper Review Complete
    May 30, 2022
  • Paper Acceptance Notification & Electronic Copyright Process Opens
    June 06, 2022
  • Submission of Presentation Only and Poster Abstracts
    June 13, 2022
  • Submission of Revised Paper for Review (if required)
    June 13, 2022
  • Notification of Acceptance for Revised Papers
    June 20, 2022
  • Author Notification of Presentation Only Acceptance
    June 20, 2022
  • Final Paper Submission
    July 11, 2022
  • Submission of Video and Speaker Release Form
    August 01, 2022