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Provided by ASME Logo The American Society of Mechanical Engineers

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Hilton Anaheim, Anaheim, CA

Conference: October 7 – 9, 2019
Exhibition: October 7 – 9, 2019

Schedule at a Glance

Announcements

We would like to thank the family of Nasser Grayeli for their sponsorship and contribution to the newly created "Nasser Grayeli Best Student Poster Awards"

Learn More About the Student Poster Competition

Conference Advanced Registration Deadline: September 1, 2019

Congratulations to InterPACK Achievement Award Winner Abhijit Dasgupta

Attend Tutorials by Leading Researchers from Industry and Academia

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2019 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

InterPACK 2019 will be held from October 7 – 9, 2019 at the Hilton Anaheim in Anaheim, CA, U.S.A. The Call for Abstracts is now out. We are currently accepting poster and technical presentation-only abstracts as well as abstracts for full-length technical papers.

See the Schedule at a Glance

To keep up with the tradition of past InterPACKs, we will heavily rely on participation and contribution from our community to fill out conference leadership, track and session chair positions. If you would like to contribute to the conference or need additional information, please contact the Conference General Chair, Sreekant Narumanchi, sreekant.narumanchi@nrel.gov. We look forward to seeing you in Anaheim, CA, in October of 2019!

InterPACK will:

  • Be a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Structural and Physical Health Monitoring, Power Electronics, Energy Conversion and Energy Storage, Autonomous, Hybrid and Electric Vehicles.
  • Seek a broad international attendee list that includes academia, industry, research institutes, funding agencies, start-ups and entrepreneurs.
  • Provide value through invitation-only presentations by colleagues in industry, national labs, and academia.
  • Aim at dissemination of the highest quality papers. We will follow a rigorous paper selection process. Conference will allow time for technical discussions in paper sessions (4 to 5 papers/90 minutes session), which will be followed up with an ASME Journal of Electronic Packaging (JEP) special issue.
  • Provide interactions between students and colleagues in industry, national labs, and academia. This enables early-career training, helps foster collaborations, and enables future employment for students in these institutions.
  • Include an exciting student poster session competition to encourage active participation of graduate students at the conference. We are hoping to provide travel grants to a large number of students who participate in the poster session competition.
  • Aim at delivering tangible value by providing networking opportunities with industry visionaries, funding agency leaders, leaders from research consortia, start-ups, and vendors/exhibitors.

Tracks for InterPACK
Track 1: Heterogeneous Integration
Track 2: Servers of the Future, Edge and Cloud Computing
Track 3: Internet of Things
Track 4: Flexible and Wearable Electronics
Track 5: Photonics and Optics
Track 6: Power Electronics
Track 7: Energy Conversion and Storage
Track 8: Autonomous, Hybrid, and Electric Vehicles
Track 9: Industry, National Laboratory, and Academia Posters

Important Dates

  • Submission of Full-Length Paper for Review
    May 07, 2019
  • Submission of Abstracts for Presentation-only and Posters
    July 15, 2019
More Information

Sponsors

InterPACK® -117.91839290000001 33.8000919 Hilton Anaheim Anaheim, CA EE4C8B