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InterPACK® > Program > Program Overview

Program Overview

Track 1: Heterogeneous Integration
Track 2: Data Centers and Modular Edge Systems
Track 3: Electronics Packaging
Track 4: Power/RF Electronics and Photonics
Track 5: Multiscale Thermal Transport and Energy Storage
Track 6: Flexible, Wearable, and Printed Electronics
Track 7: Transportation Systems, AI and Machine Learning
Track 8: Interactive Presentations
Track 9: Panels, Tutorials, and Workshops