Program Overview

Heterogeneous integration is the integration of Multi functionality for several dies in close proximity using such process as Active on Active, Chip on Wafer on Substrate and Wafer Level Fan-out. This track is seeking papers addressing the Thermal management, thermo-mechanical stress, assembly process and reliability for both component and system level.

This track focuses on technologies and methods for the thermal management, mechanical design, and control of data center and server hardware. It brings together research on cooling systems, mechatronics, tribology, control techniques, and digital twin software to support reliable, efficient, and sustainable computing infrastructure.

Contributions cover emerging cooling solutions for future high-performance systems, practical improvements to existing infrastructure, and the application of data center digital twins for modeling, monitoring, and optimizing thermal and energy performance. The track also includes research on head–disk interfaces in hard disk drives, addressing mechanical behavior, surface interactions, and control challenges, while considering both fundamental technical issues and real-world operational needs.

Topics of interest include:

• Rack-level Cooling
• Thermal Interface Materials
• Advanced Cooling Technologies
• Vibration Control and Simulation
• Lubrication and Tribology

This track addresses the design, testing, and modeling of electronic packaging technologies required to operate reliably in extreme and unconventional environments. It solicits experimental and simulation-based contributions spanning mechanical, thermal, electrical, magnetic, and materials challenges encountered beyond traditional operating limits, including quantum and cryogenic systems, hypersonic and high-temperature platforms, planetary and deep-space missions, high magnetic-field environments, directed-energy and high-power systems, high-radiation and nuclear environments, and extreme pressure and underwater applications. Emphasis is placed on advanced materials and manufacturing, multiphysics modeling and digital twins, and reliability assessment, with a strong focus on cross-disciplinary approaches that link experiments and simulations to real-world extreme-environments.

This track highlights the latest research breakthroughs in the electro-thermal analysis of wide/ultra-wide bandgap semiconductor devices and light-emitting diodes for power conversion, wireless communication, and harsh environment sensor applications. This track will present work on multi-physics co-design, device- and package-level thermal management, and thermo-mechanical reliability of state-of-the-art power/radio frequency (RF) electronics and photonics.

The continued push toward faster, smaller, and more power-dense electronic and energy systems has made micro- and nanometer-scale, as well as multiphase, heat transfer a technological necessity. As dimensions shrink and operating frequencies rise, classical heat transfer models break down, and energy transport is governed by interfacial phenomena, non-equilibrium processes, and phase-change mechanisms at solid–solid, solid–liquid, and liquid–vapor interfaces. This track solicits experimental, theoretical, and computational contributions relevant to electronic packaging and thermal management, including interfacial thermal boundary conductance; near-field thermal phenomena; heat transport in thin films, interconnects, and thermal interface materials (TIMs); nanoscale and ultrafast thermal metrology; thermal transport in low-dimensional and hybrid materials; multiscale approaches for packages and chiplets; multiphase and phase-change heat transfer; and physics-based thermal management strategies for high-power and high-frequency systems. The Multiscale Thermal Transport and Energy Storage Track highlights state-of-the-art thermal transport and storage work being done at the intersection of varying length and time scales. Areas of interest include (but are not limited to) passive and active cooling techniques in microelectronics, physics-informed modeling and optimization of electronic materials for improved heat dissipation, nanoscale and microscale thermal characterization and modeling, novel fabrication techniques for thermal management, and multiscale optimization of electronic cooling architectures that span multiple decades of length and/or time scales.

The Flexible, Wearable, and Printed Electronics Track includes diverse contributions highlighting recent progress related to advanced processing, reliability, and novel applications of electronics packaging primarily based on additive deposition.

Presentations will emphasize the maturing nature of the field, with a significant focus in repairability and reliability of printed electronics as well as the development and performance of sustainable inks. The track will also cover recent advancements in processing approaches enabling complex, multi-layer circuits as well as in-mold fabrication.

• Sensors, systems, and instrumentation: Advanced driver assistance systems, RADAR, High temperature sensors
• Applications of Digital Twin, Artificial Intelligence (AI), and Machine Learning techniques, algorithms, and Robotics
• Novel AI/ML methods for design for manufacturability (DfM) and reliability (DfR)
• Advanced computational simulations in engineering fields of mechanics, electromechanics, and electronics, as well as simulation methods and optimization methods.

Information on this track is forthcoming.

This track invites contributions spanning fundamental to applied research in mechatronics with characteristic dimensions in the micro- and nanometer range. Micro- and nanoscale mechatronic systems integrate mechanisms, actuators, sensors, control architectures, and energy sources to function as intelligent, highly compact machines. Rapid advances in these systems are enabling new capabilities across energy systems, information technologies, biomedical applications, MEMS, and the Internet of Things (IoT). This track will broadly cover recent engineering approaches, from understanding and modeling fundamental micro- and nanoscale phenomena to the design, integration, and evaluation of system-level functionality and performance.