Electronics packaging comprises the design and manufacture of supporting structures and enclosures for electronics ranging from individual semiconductor devices up to complete systems. Packaging of an electronic system provides electrical interconnections between chips, substrates, boards, and backplanes; cools the electronic devices; and protects devices from mechanical damage (e.g. shock, vibration), corrosion, RF interference, and electrostatic discharge. This track will present work on new materials (e.g. sintered copper), new manufacturing processes (e.g. additive manufacturing), new packaging structures (e.g. 3D packaging), and the assessment of their reliability (e.g. AI prognostics).