Women in Engineering Panel
Panel Focus: Discussion on women's role and contribution in engineering disciplines. Panelists will share their own experiences in engineering exercise, including teaching, research and progression exercise.
Panel Moderator: Leila Choobineh
Panelists: Borca Tasciuc (Rensselaer Polytechnic Institute), Tannaz Harirchian (Intel), Yoonjin Won (University of California, Irvine), Amy Spencer Fleischer (Cal Poly), Amanie Abdelmessih (California Baptist University), Ghazal Mohsenian (Binghamton University), Rahima K Mohammed (Intel)
Track 1 Panel: Progressing or Not Progressing During Two Years of HIR
Panel Moderators: Gamal Refai-Ahmad and Leila Choobineh
Panelists: Bill Bottom (3MTS), Ravi Mahajan (Intel), Bahgat Sammakia (Binghamton University), Amr Helmy (University of Toronto)
Track 2 Panel: System / Data Center Liquid Cooling
Panel Focus: The development of liquid cooling of computer systems and data centers has provided a path to improve both cooling energy efficiency and thermal performance compared to conventional air cooling technology. Liquid cooling technology has been deployed in commercial systems including water cooled supercomputers and data centers. The development of liquid cooling has included a range of scale from macroscopic rack level heat exchangers to micro-scale fluidic structures in chip embedded cooling. The panel will discuss the different coolants deployed including water to dielectric fluids and the many technology approaches used to implement liquid cooling for thermal management of computer systems.
Panel Moderator: Saket Karajgikar
Panelists: Veerendra Mulay (Facebook), Timothy Chainer (IBM), Jin Yang (Intel), Jimil Shah (3M), Chris Malone (Google)
Track 4 Panel: Application Challenges in Flexible and Wearable Electronics
Panel Focus: Applications across multiple markets are driving development of flexible and wearable electronics use cases. The panelists will share their insights regarding these opportunities as well as the corresponding technical challenges given their industry and government research experience. There will be plenty of time for an interactive conversation with the audience after the panel introductions.
Panel Moderator: Valerie Marty (Connected Micro LLC)
Panelists: Stephanie Harvey (SEMI), James Chew (Cadence), Benjamin Leever (NextFlex), Janos Veres (PARC Research)
Track 6 Panel: Transient Thermal Management – Considering Thermal Capacitance and Not Just Thermal Resistance
Panel Focus: There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions are steady state heat sinks that provide enough continuous cooling capacity to address the peak thermal load as if it were a steady-state condition. Such a conservative approach guarantees satisfying the thermal challenge, but it can result in significant cooling overdesign. This panel will investigate improving system size and weight without sacrificing platform performance by considering transient thermal mitigation methods.
Panel Moderator: Sukwon Choi (Pennsylvania State University)
Panelists: Lauren Boteler (US Army Research Laboratory) Peter DeBock (General Electric) Patrick Shamberger (Texas A&M University) Nicholas Niedbalski (US Air Force Research Laboratory) David Huitink (University of Arkansas)
Track 7 Panel: Extreme Fast Charging of Lithium-ion Batteries
Panel Focus: Extreme fast charging capability of lithium-ion batteries is desired for various applications ranging from smart electronics to electric vehicles. However, major challenges still exist, such as lithium plating and rapid heat generation within batteries, power and thermal management design of vehicles/devices and charging infrastructure. Both lithium plating and heat generation could significantly reduce battery life and increase safety failure risks. This panel will explore the challenges and opportunities in extreme fast charging of lithium-ion batteries from the perspectives of lithium plating, thermal management, materials and vehicles/devices.
Panel Moderators: Guangsheng Zhang and Partha Mukherjee
Panelists: Corey T. Love (Naval Research Laboratory), Tanvir R. Tanim (Idaho National Laboratory), Xiao-Guang Yang (Pennsylvania State University), Aron Saxon (National Renewable Energy Laboratory)
Track 8 Panel: Reliability in the age of AI: Opportunities and Challenges
Panel Focus: Increased functionality of everyday use machines – ranging from washers to highly automated vehicles – has been made possible through employment of more sensing, more actuation, and more processing capabilities. At the same time, the increased complexity introduces more ways in which a machine can breakdown. The incredible advancement in our sensing capabilities, coupled with connectivity, offers unprecedented insights into a wide variety of processes and operations. The operating conditions of machines can be mapped with greater accuracy while carrying out performance monitoring and predicting failures. The envelope of reliability can essentially be stretched and redefined. While the opportunities abound, tremendous challenges exist towards properly housing the data, cataloging it, cleaning it, labeling it, and creating the right models to extract actionable insights through use of Artificial Intelligence and Machine Learning. This panel will explore the challenges and opportunities posed by our ability to collect data from machines and components during their manufacturing and operation, and identify roadblocks that must be overcome to extract value from it to help machines last longer, and fail gracefully towards the end of life.
Panel Moderator: Azeem Sarwar
Panelists: Mohak Shah (LG Electronics), Ercan Dede (Toyota Research Institute), Przemyslaw Gromala (Robert Bosch GmbH), Anna Prakash (Intel Corporation), Pradeep Lall (Auburn University)