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Provided by
The American Society of Mechanical Engineers
InterPACK® 2019
Hilton Anaheim,
Anaheim, CA
Conference: October 7 – 9, 2019
Exhibition: October 7 – 9, 2019
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Gold
ASE Group
Huazhong University
Intel
Microsanj
S3IP SUNY Binghamton
Silver
CALCE
Infineum
Journal of Electronic Packaging
Laird Performance Materials
Novark
NREL
POETS
Stanford nanoHeat
Toyota
University of Texas at Arlington
University of Toronto
Washington University St. Louis
Bronze
PennState College of Engineering
World Scientific Publishing Company
General Sponsors
Georgia Tech
