Information and Eligibility
The Turbo Expo Early Career Engineer Travel Award is intended for early career engineers working in industry, in government or in academia to obtain travel funding to attend ASME Turbo Expo to present a paper which they have authored or co-authored. The purpose is to provide a way for more people to participate in the annual Turbo Expo.
What's included in the Travel Award?
- One Complimentary ASME Turbo Expo Technical Conference Registration
- Complimentary hotel accommodations (Sunday to Friday)
- Up to $1,000 toward approved travel expenses
The nominee must have obtained an academic degree (Bachelor, Master, PhD, or equivalent degrees) in an engineering discipline related to turbomachinery within five years from the year of the Turbo Expo that the applicant wishes to attend. The paper or poster being presented can be research results from work completed either while pursuing an academic degree, or after leaving school and entering the job field. Post-doctoral researchers in academic institutions are eligible so long as they have been in post no longer than five years full time equivalent.
Application Requirements and Process
The application package must contain:
- A succinct motivational letter (max 1 page) illustrating reasons that should lead to a positive decision by the selection committee.
- Any other document the applicant wishes to attach in order to support the application. Examples: Proof of outstanding awards, letters of recommendation, award recognition, etc.)
The selection committee rewards brevity: valuable accomplishments are self-explanatory.
Congratulations to the 2024 TEECE Award Recipients
Ananth Sivaramakrishnan Malathi, IIT Madras
Andrea Notaristefano, GE Avio Aero
Antoine Durocher, McGill University
Bogdan Cezar Cernat, von Karman Institute for Fluid Dynamics
Deepanshu Singh, University of Cambridge
Dino Celli, Air Force Research Laboratory
Dr. Dimitra Tsakmakidou, Rolls-Royce
Dr. Donato Maria Palermo, GKN Aerospace Sweden AB
Elissavet Boufidi, von Karman Institute for Fluid Dynamics
Eric DeShong, Honeywell Aerospace Technologies
Howon Yi, LG Electronics
Lakshya Bhatnagar, Purdue University
Lukas Benjamin Inhestern, Purdue University
Majid Asli, Brandenburg University of Technology in Germany
Manu S Kamin, University of Cincinnati
Marcel Otto, University of Central Florida
Marco Bicchi, Nuovo Pignone, Baker Hughes
Thomas Corbett, Pratt and Whitney
Xiao He, Imperial College London
Yu Xia, Ansys UK Ltd