Conference: October 25 – 27, 2022
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
The journal publishes papers that address 1) thermal management, applied mechanics and technologies for microsystems packaging; 2) critical issues in systems integration; 3) emerging packaging technologies and materials with micro/nano structures; and 4) general small scale systems.
The journal serves researchers and engineers working in academic and industrial settings. In addition, leaders in the field are invited to publish review articles on hot, emerging and fundamental topics.
