The 28th ASME Annual Conference on Information Storage and Processing Systems (ISPS 2019) to be held in at Center for Memory and Recording Research (CMRR), University of California in San Diego, CA, from June 27-28, 2019.
This event is intended to provide a forum for international researchers from the academia and industries to share their findings, to network, and to foster collaboration opportunities in technical and business areas. It is also intended to attract and groom graduate students in the ISPS technical area and related industries.
The conference focuses on information storage and processing systems, as well as intelligent and precision equipment. The target markets include but not limited to: hard disk drive, flash memory, optical data storage, biomedical equipment, smart sensors/actuators/materials, intelligent machines, storage systems, imaging and printing equipment. Researchers are working towards enhancing the functionality of the said systems and equipment, making them more powerful (faster in operation, etc), user-friendly, robust and reliable, and environmentally friendly.
The multinational companies in the US, Japan and South Korea (e.g., WD, HGST, Seagate, HP, TDK, Samsung etc.) are among the main R&D drivers, whereas in Korea and Singapore, there are many national laboratories working in this area.
ISPS’ 19 is soliciting 1-page abstract and 3-page papers for each of the technical tracks outlined below. The 3-page paper is optional and not required for technical presentation. The 3-page papers accepted and presented will be published in the official conference proceedings. The conference includes keynote and invited speaker presentations.
The scope of the conference covers the following interdisciplinary research and application topics related to information storage and processing systems, and the application of data in mechanical engineering
- Tribology, Dynamics and Servo control of Nano-Micro systems: Head-Media interface, magnetic head technology, servo and other topics in conventional perpendicular magnetic recording, and mechanical science and technology in the micro/nano scale systems
- Packaging Technologies for Solid-State Flash Storage and Memory: Thermal management, die warpage control, crack and other packaging topics for solid-state storage and memory devices.
- Heat Assisted Magnetic Recording & Microwave Assisted Magnetic Recording: Systems, head, media, head disk interface, and other technical issues for HAMR/MAMR
- Data Storage Solution and System for Data Center Operation and Optimization: Thermal management for server, vibration control, etc.
- Emerging and future data Storage Technologies: Next generation data storage solutions based on magnetic/optical/solid-state memory, including phase change, MRAM, ReRAM, quantum storage, DNA storage
- Dynamics and Control for Future Technologies: Dynamics and control for highlighted engineering fields including robot, unmanned aerial vehicle, unmanned ground vehicle, and next-generation transportation
- Smart Materials: Materials science and engineering for information storages, displays, energy-recycle, and nano/micro devices, materials characteristic control and smart material applied system
- Smart Sensors and Actuators: Various sensors and actuators for promising engineering fields such as haptics, IOT application, biological application, motion based detection & actuation, and autonomous vehicle solutions
- Micro/Nano & Biomedical Mechatronic Systems: Science and technologies on micro/nano mechatronic systems and MEMS/NEMS/MOEMS for biomedical application
- Optical Imaging Devices and Opto-mechatronic Systems: Optical imaging systems and sensing devices detecting optical information, and opto-mechatronic systems based on imaging and sensing devices.
- Flexible Media Handling Machines and Printed electronics, Exposing and Printing Technologies: Copy machines, printers, scanners, office automation equipment, flexible media dynamics and control
- Advanced Simulation in Science and Engineering: Advanced computational simulations in engineering fields of mechanics, electro-mechanics, and electronics and simulation methods and optimization methods
- Application of Data and Artificial Intelligence in Mechanical Engineering: Using big data and AI for solving problems in the mechanical domain: such as product failure analysis, smart manufacturing, etc.
We look forward to seeing you to San Diego in June, 2019!
ISPS 2019 offers the following features:
- One Best Paper Award for each technical track.
- One Best Student Paper Award.
- Three ISPS Division Graduate Student Fellowships in the form of USD 2000 or 1000 each and registration fee waiver.
- Five Conference Scholarships for graduate students in the form of registration fee waiver.
- Discounted registration fees for ASME members and students.
- Special issue in the Microsystem Technologies Journal of the full-size papers presented at the conference.
- Conference supported by ASME centralized web hosting and paper submission handling process.
- GoGreen initiative to use online access of conference materials (on-site WiFi access provided).
Fellowship & Scholarship Award Application
Support materials: ISPS final paper, resume, one reference letter and one page research statement. Please send your application materials to Dr. Stefan Weissner. Deadline: May 20, 2019.