Skip to content
Program
InterPACK® 2024 > Program > Program Overview

Program Overview

Heterogeneous integration is the integration of Multi functionality for several dies in close proximity using such process as Active on Active, Chip on Wafer on Substrate and Wafer Level Fan-out. This track is seeking papers addressing the Thermal management, thermo-mechanical stress, assembly process and reliability for both component and system level.

This track looks into thermal management of Data Center and Server Hardware. It presents research works that explore, develop and practice advanced cooling technologies into the future, as well as means to improve capacity and efficiency of traditional infrastructure designs. Both fundamental challenges and operational opportunities are being investigated by works in this track.

  • Infrastructure and Hardware Thermal Management
  • Rack level Cooling
  • Thermal Interface Materials
  • Advanced Cooling Technologies

 

Electronics packaging comprises the design and manufacture of supporting structures and enclosures for electronics ranging from individual semiconductor devices up to complete systems. Packaging of an electronic system provides electrical interconnections between chips, substrates, boards, and backplanes; cools the electronic devices; and protects devices from mechanical damage (e.g. shock, vibration), corrosion, RF interference, and electrostatic discharge. This track will present work on new materials (e.g. sintered copper), new manufacturing processes (e.g. additive manufacturing), new packaging structures (e.g. 3D packaging), and the assessment of their reliability (e.g. AI prognostics).

This track highlights the latest research breakthroughs in the electro-thermal analysis of wide/ultra-wide bandgap semiconductor devices and light emitting diodes for power conversion, wireless communication, and harsh environment sensor applications. This track will present work on the multi-physics co-design, device/package level thermal management, and thermo-mechanical reliability of state-of-the-art power/radio frequency (RF) electronics and photonics.

The Multiscale Thermal Transport and Energy Storage Track highlights state-of-the-art thermal transport and storage work being done at the intersection of varying length and time scales. Areas of interest include (but are not limited to) passive and active cooling techniques in microelectronics, physics-informed modeling and optimization of electronic materials for improved heat dissipation, nanoscale and microscale thermal characterization and modeling, novel fabrication techniques for thermal management, and multiscale optimization of electronic cooling architectures that span multiple decades of length and/or time scales.

The Flexible, Wearable, and Printed Electronics Track includes diverse contributions highlighting recent progress related to advanced processing, reliability, and novel applications of electronics packaging primarily based on additive deposition. Presentations will emphasize the maturing nature of the field, with a significant focus in repairability and reliability of printed electronics as well as the development and performance of sustainable inks. The track will also cover recent advancements in processing approaches enabling complex, multi-layer circuits as well as in-mold fabrication.

  • Sensors, systems, and instrumentation: Advanced driver assistance systems, RADAR, High temperature sensors
  • Applications of Digital twin, Artificial intelligence (AI), and Machine Learning techniques and algorithms
  • Novel AI/ML methods for design for manufacturability (DfM) and -reliability (DfR)

The Interactive Presentations track offers students the opportunity to present their research posters and interact with experts in the field from industry, academia, and national laboratories. The poster and networking session will be held simultaneously with an industry career fair so students can share their resumes and get connected to representatives from industry. Outstanding posters will be selected for awards. Posters will be judged based on the scientific merit, technical presentation skill, quality of the poster display, handling Q & A, and the overall impact of the work.

Six panel sessions will discuss the latest industry trends and challenges:

  • Mobile, IoT, Healthcare, Automotive, and beyond
  • Wearable and Flexible electronics
  • Data center and telecom challenges and opportunities
  • Mechanics and reliability in advanced packaging
  • Women in Engineering
  • Additive Manufacturing

Four tutorials will cover the following areas of research:

  • Net zero computing: liquid-cooling and heat reuse
  • Efficient energy systems, sustainability, and batteries
  • Quantum computing
  • Nano-photonics and opto-electronic devices

Five workshops will be offered by representatives from academia, industry, and national laboratories:

  • Intel Robotics and AI Workshop
  • K16 Professional Development and Mentoring Workshop
  • NIST Roadmaps Directions to CHIPS Act (Part 1 & 2)
  • Electro-Thermal Co-Design of Ultra-Wide Bandgap Electronics

 

Resources

Related Sites

ASME

© 2024 The American Society of Mechanical Engineers. All rights reserved.