PRESENTER/INSTRUCTOR
Dr. Prabhakar Subrahmanyam
Intel

Tutorial Title: Chasing Hotspots via Jet Vector Impingement – A dynamic hotspot mitigation method in high power density Silicon

Abstract: High power density silicon, particularly with non-uniform power distribution, presents significant challenges in thermal management due to the formation of localized hotspots. These hotspots, which vary in location and intensity depending on workload, can severely limit performance and reliability. Direct jet impingement offers superior heat removal capabilities due to high heat transfer coefficients, but traditional implementations lack the ability to dynamically target hotspots. In this talk/presentation, I will explore a patented jet vector impingement technique that actively tracks and cools hotspots in real-time. Case studies involving both bare die silicon and a Xeon multi-chip module will be presented, showcasing the effectiveness of jet vector impingement in reducing peak temperatures and improving overall thermal performance. Pre- and post-impingement temperature data will be analyzed to quantify the benefits of this innovative cooling approach.

Biography: Dr. Prabhakar Subrahmanyam is a Senior Technical Lead and Senior Staff Principal Thermal Engineer at Intel, renowned for his expertise in thermal management from devices to data centers. He specializes in cooling at the silicon and package levels for post-silicon validation and broader strategies across the silicon chip ecosystem, including client, desktop, server, and AI silicon. Notably, he served as the chief validation thermal architect for the Ponte Vecchio chip, Intel's first exascale GPU chip, which powers the Aurora supercomputer at the U.S. Argonne National Laboratory. Dr. Prabhakar holds a PhD and Masters in Aerospace Engineering, with a focus on reentry heat transfer, as well as a first Masters in Computer Science and a Bachelors degree in Physics. He has authored over 60 papers and holds more than 50 patents in thermal management. His contributions have earned him 5 AIAA Best Paper Awards, 3 IEEE Best Paper Awards, and a gold medal for the best thesis. In addition to his work at Intel, Dr. Prabhakar is a Visiting Professor at SRM University in India, where he established a lab for electronic cooling and teaches a Capstone program in Electronic Cooling, pioneering an industry internship within the classroom environment for undergraduate students.

 

PRESENTER/INSTRUCTOR
Dr. Pritish R. Parida
IBM

Tutorial Title: Modeling Energy Efficient Two-Phase Heat Transfer System

Abstract: Exponential growth of AI workloads is driving the need for high performance chip packages that cannot be thermally managed by energy- and water-intensive chilled air-cooling solutions implemented in Data Centers today. A two-phase heat transfer system, that utilizes the liquid to vapor phase conversion of a working fluid for transferring the heat to the ambient environment, can provide energy-efficient thermal management of high-performance AI systems while eliminating water consumption and maintaining system reliability in any geographical location. This short tutorial will describe the exemplar computationally manageable high-fidelity components- as well as system-level models that are necessary for the assessment and development of such a cooling system.

Biography: Dr. Pritish Parida is a Senior Research Scientist at IBM Research. He is currently the co-PI of IBM-ARPA-E program on Systems Two-phase cooling (DE-AR0001577). He has extensive experience in the development of cutting-edge thermal technologies including chip-embedded two-phase cooling, for high performance computing systems and embedded applications such as UAVs (unmanned aerial vehicles), RF (radio frequency), and 5G devices. He obtained his Ph.D. in Mechanical Engineering from Virginia Tech. Dr. Parida has received several technical and innovation awards at IBM as well as outside including Outstanding Technical Achievement Award (2016, 2021, 2022), Outstanding Research Award (2021), Research Division Award (2012, 2016, 2021), Outstanding Technical Paper Award (2012), Best Paper Award (SEMI-Therm 2017), Best Poster Award (GOMACTech 2017). Dr. Parida has co-authored over 60 peer-reviewed publications, three book chapters, and holds over 100 issued patents.

 

PRESENTER/INSTRUCTOR
Dr. Amr S. Helmy
University of Toronto

Tutorial Title: Scaling Prospects of Machine Learning Compute Resources through Light

Abstract: This course provides an in-depth exploration of the tools, technologies, and strategies that are advancing the scaling of compute fabrics to vastly expand machine learning capabilities through photonics. It delves into how photonics can revolutionize machine learning implementations within the CMOS ecosystem, with a particular emphasis on enhancing interconnection density in system-in-package (SiP) designs. As the industry increasingly focuses on co-packaged optics as a key strategic direction, understanding the complexities of this technology is crucial. The capabilities and functionalities of co-packaged optics will significantly impact the benefits they can deliver to the broader CMOS ecosystem.

Biography: Dr. Amr S. Helmy is a professor in the department of electrical and computer engineering at the University of Toronto. Prior to his academic career, Amr held a position at Agilent Technologies - UK, between 2000 and 2004. At Agilent his responsibilities included developing lasers and monolithically integrated optoelectronic circuits. He received his Ph.D. and M.Sc. from the University of Glasgow with a focus on photonic integration technologies, in 1999 and 1995 respectively. His research interests include photonic device physics, with emphasis on plasmonic nanostructures, nonlinear and quantum photonics addressing applications in information processing / sensing, and data communications. Amr is an active volunteer and leader of the IEEE Photonics Society, currently serving as an Elected Member of the Society’s Board of Governors and as a Distinguished Lecturer. He was also the recipient of the Society’s 2019 Distinguished Service Award.

 

PRESENTER/INSTRUCTOR
Dr. Nitin Karwa
Honeywell

Tutorial Title: Thermal Management for Electric Vehicles: Batteries and Power Electronics

Abstract: Heat transfer is a limiting factor in the reliability and performance of next-generation batteries and power electronics for electric vehicles (EVs). While researchers focus on optimizing device performance to improve, for example, battery capacity (driving range), thermal effects have often been relegated to a secondary concern. But overheating batteries are a major topic of concern as they have caused fires across a range of systems, and overheating power electronics degrade the system reliability. Further, electric vehicles, being mobile platforms, have limited heat dissipation pathways, exacerbating thermal challenges. This talk will discuss two key thermal management challenges: (1) effective thermal management of battery systems (including the multi-physics coupling of heat transfer, electrochemistry, mechanics, and fluid dynamics within thermal management systems) and (2) improving reliability of power electronics through novel architectures that incorporate phase change material-based thermal buffers to reduce temperature spikes throughout the driving cycle. Ultimately, thermal informed design of batteries and power electronics can lead to more efficient, reliable, and safe electric vehicles.

Biography: Dr. Nitin Karwa currently works as the Principal R&D Engineer at Honeywell’s Buffalo Research Labs. In this role, he focuses on developing new heat transfer fluids for various applications such as electronic cooling, air conditioning, and industrial heat pumps. Dr. Karwa holds a PhD in Mechanical Engineering from the Technical University of Darmstadt in Germany and has spent 3 years on postdoctoral research at universities in Germany and Australia. With 11 years of industry experience, he specializes in vapor compression systems for HVAC and industrial heating, and two-phase heat transfer systems for electronics cooling. Additionally, he has authored over 25 articles in peer-reviewed international journals and conferences on heat transfer and energy systems, making significant contributions to the academic community.

 

PRESENTER/INSTRUCTOR
Dr. Amy Marconnet
Purdue University

Biography: Amy Marconnet is a professor of Mechanical Engineering and professor of Materials Engineering (by Courtesy), as well as a Perry Academic Excellence Scholar, at Purdue University. She received a B.S. in Mechanical Engineering from the University of Wisconsin – Madison in 2007, and an M.S. and a PhD in Mechanical Engineering at Stanford University in 2009 and 2012, respectively. Her dissertation focused on thermal phenomena in nanostructured materials. She then worked briefly as a postdoctoral associate at the Massachusetts Institute of Technology, before joining the faculty at Purdue University in August 2013. Her work has won outstanding paper awards at ITherm 2012, InterPACK 2017, ITherm 2019, ITherm 2023, and ITherm 2024. In 2017, she won the Woman in Engineering Award from the ASME Electronics & Photonics Packaging Division (EPPD). In 2020, she won the Bergles-Rohsenow Young Investigator Award in Heat Transfer and the Outstanding Graduate Student Mentor from the Official Mechanical Engineering Graduate Association (OMEGA) and the College of Engineering. She won a Humboldt Fellowship for Experienced Researchers and conducted research at Karlsruhe Institute of Technology in the 2021-22 academic year.

 

PRESENTER/INSTRUCTOR
Dr. Mark D. Poliks
Binghamton University

Biography:Mark D. Poliks is a SUNY Distinguished Professor and Empire Innovation Professor of Materials Science and Engineering and Systems Science and Industrial Engineering at the Thomas J. Watson College of Engineering and Applied Science, Binghamton University, State University of New York. He is the founding director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of the federally supported NextFlex Manufacturing USA. Poliks has made sustained contributions to the fields of materials processing, electronics packaging, flexible, hybrid and additive electronics that are relevant to a variety of medical and industrial applications. Poliks was the General Chair of the 69th IEEE Electronic Components and Technology Conference (ECTC). He is a Fellow of NextFlex, an elected member of the IEEE Electronics Packaging Society (EPS) Board of Governors, serves as the director of student programs and is an IEEE Distinguished Lecturer.