Program

InterPACK® 2024 > Program > Workshops

Workshops

Date: October 10, 9:30am – 10:45am Pacific Time
Location: California-Salon-M, Holiday Inn San Jose – Silicon Valley

Chair/Moderator: Sreekant Narumanchi, U.S. Department of Energy (DOE) National Renewable Energy Laboratory (NREL)

Speakers:

Mark Spector, U.S. Office of Naval Research - ONR
Benjamin Leever, U.S. Air Force Research Laboratory - AFRL
Mike Fish, U.S. Army Research Laboratory - ARL
Sreekant Narumanchi, U.S. DOE NREL

Dr. Mark S. Spector is a Program Officer in the Sea Warfare and Weapons Department at the Office of Naval Research where he manages research in thermal science, metamaterials, energy conversion, and climate resilience. In addition, he sits on the Steering Committee of the Department of Defense Energy and Power Community of Interest, the US Navy Climate Working Group, and the NATO Applied Vehicle Technology Power and Propulsion Systems Technical Committee. Previously, he worked as a Research Physicist at the Naval Research Laboratory. He received his doctorate in Physics from the Massachusetts Institute of Technology and bachelor's degrees in physics and applied mathematics from the University of California at Berkeley.

Abstract: Thermal Challenges for Future Military Platforms: Modern land, sea, and air warfare technologies are trending towards significantly higher power loads with transient behavior that present unique challenges in thermal system design. Traditional design approaches assume steady state operation and rely on overdesign to meet worst-case scenarios. Moreover, advanced control techniques are virtually absent in most thermal systems. Therefore, tremendous opportunities exist to reduce the size, weight and power consumed by thermal management systems associated with these loads through the development of innovative electronic packaging approaches, the design of energy-efficient system architectures that utilize advanced control strategies, and their effective integration onto military platforms.

Dr. Benjamin Leever is currently the Chief of the Polymers & Specialty Materials Branch in the Air Force Research Laboratory (AFRL) Materials & Manufacturing Directorate. Dr. Leever leads a team of approximately 100 government, military, and contractor personnel, managing an annual budget of ~$40M. In this role, he contributes to the development of next-generation technologies to deliver capabilities to the U.S. Air Force (USAF) and U.S. Space Force (USSF) related to survivability in contested and extreme environments. Prior to this current role, Dr. Leever served the Manufacturing & Industrial Technologies division as the Technical Director. He also served as Government Chief Technology Officer of NextFlex, a $200M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. Earlier in his career, Dr. Leever served as the Advanced Development Leader for AFRL’s Soft Materials Branch, leading an external portfolio focused on flexible electronics and biomaterials. He has also previously led a research team focused on the development and modeling of multifunctional materials for structural power applications. Dr. Leever earned a B.S. in Chemical Engineering from the University of Cincinnati and a Ph.D. in Materials Science and Engineering from Northwestern University.

Abstract: Electronics processes, components, and packaging for extreme environments: The USAF and USSF need electronic systems that can survive extreme hot and cold temperatures, large temperature swings, high vibrations, and other harsh conditions. This presentation will highlight materials and process innovations as well as ongoing challenges in AFRL's work to expand the operating window of electronic devices and packaging in extreme environments.

Dr. Michael Fish leads the transient thermal program as part of the Power Integration and Architectures Branch at the U.S. Army Research Laboratory. He has expertise in embedded thermal management, simulation, and thermal test bed development. His current effort is in the packaging and management of highly transient electronic systems, with particular focus on directed energy weapons and vehicle electrification and power conversion. He holds a Ph.D. in Mechanical Engineering from the University of Maryland, College Park where he studied thermal phenomena in heterogeneously integrated electronic systems. He received his B.S. and M.S. from the University of Virginia, studying micro/nanoscale heat transport and thermal metrology.

Abstract: The electrified burden on Army platforms and soldiers has been and will continue to dramatically increase as next-generation sensors, edge computing, and electronic and directed energy warfare mature and are deployed to future theaters. From an operational energy perspective, this means electronics and their packages must do more with less: higher output or throughput – often under extreme conditions – while minimizing size and weight. To accomplish this will require engineering beyond the edge of currently available design trade spaces, made possible by both advances in materials as well as a mission-aware reconceptualization of how components in a package interoperate with each other and systems they are embedded in to maximize effectiveness

Dr. Sreekant Narumanchi is a Distinguished Member of Research Staff and Manager of the Advanced Power Electronics and Electric Machines group within the Center of Integrated Mobility Sciences at the National Renewable Energy Laboratory, where he has completed almost 20 years. He leads a Group of 17 researchers focused on packaging, thermal management and reliability of power electronics and electric machines for electric-drive vehicles and multiple other applications. His group has collaborated with over 80 institutions cutting across industry, universities, national and research labs, and federal agencies. Sreekant is an American Society of Mechanical Engineers (ASME) Fellow, and recipient of the 2023 ASME Avram Bar-Cohen Memorial Medal and the 2022 THERMI Award. He has over 120 peer-reviewed publications and 5 patents. Sreekant had/has multiple leadership roles in conferences, journals, committees, and advisory boards. He received a Ph.D. from Carnegie Mellon University (2003), M.S. from Washington State University (1999), and B. Tech. from Indian Institute of Technology Kanpur (1997), all in Mechanical Engineering.

Abstract: Advanced Power Electronics and Electric Machines Packaging, Thermal Management, and Reliability for Electric-Drive Vehicles: Electronics, power electronics, and electric machines are becoming important for an array of mobility/transportation, renewable energy, and energy efficiency applications. I will describe some metrics, challenges, and opportunities for power electronics, electric machines, and electric traction-drive systems for light-, medium-, and heavy-duty vehicle applications. After that, I will give a brief overview of my group's research activities in power electronics, electric machines and integrated (electric) traction-drive systems. This includes thermal management, thermomechanical reliability, state-of-health monitoring, and power module design, development, fabrication, and characterization aspects. I will conclude with some key questions for the audience pertaining to opportunities and research and development pathways.

Date: October 8, 3:50pm – 5:15pm Pacific Time
Location: California-Salon-K, Holiday Inn San Jose – Silicon Valley

Chairs/Moderators:

Tiwei Wei, Purdue University
Xiangyu Li, University of Tennessee Knoxville
Ronald J Warzoha, United States Naval Academy

Speakers/Mentors:

Bidzina Kekelia, National Renewable Energy Laboratory (NREL)
Soloman Adera, University of Michigan
Prabhakar Subrahmanyam, Intel

Dr. Tiwei Wei is an Assistant Professor at Purdue University's School of Mechanical Engineering. Prior to his role at Purdue, he completed a postdoctoral research tenure in Stanford University's NanoHeat lab between 2020 and 2022. He received his Ph.D. degree in the 3D system integration department at Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020, focusing on developing electronic cooling solutions for high-performance 3D systems. Before that, he held senior research positions at Tsinghua University and Hong Kong University of Science and Technology from 2011 to 2015, delving into advanced microelectronic packaging techniques. His current research emphasis encompasses advanced semiconductor packaging and heterogeneous integration, spanning processing, materials, architecture development, chip-package interactions, reliability, and efficient thermal management technologies. He authored over 60 scientific publications in leading journals, conference proceedings, and authored over 10 patents. Dr. Wei actively contributes to the academic community, serving as a session chair and member of the technical program committee in various electronic packaging conferences like IEEE ESTC, REPP, 3DIC, SHTC, Itherm and EPTC. Additionally, he has held leadership roles such as vice-chair of IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter and currently the founder and chair of IEEE EPS Central Indiana Chapter. He received the 2020 IMEC Ph.D. Excellence Award and the 2024 Intel's Rising Star Faculty Award.

Dr. Xiangyu Li is an assistant professor at the Department of Mechanical, Aerospace, and Biomedical Engineering at the University of Tennessee Knoxville. His research focuses on thermal management in buildings and electronics to enhance energy efficiency. Key areas of his work include the design of high-temperature heat exchangers, water adsorption for atmospheric water harvesting and thermal energy storage, and solar desalination.

Prior to this appointment, he received his Ph.D. degree from Purdue University with Prof. Xiulin Ruan and worked as a postdoctoral associate at MIT with Prof. Evelyn Wang. He is the author of 22 peer reviewed journal papers and holds three US and international patents. His work on radiative cooling paint is awarded as The Best Inventions of 2023 by TIME magazine and holds the Guinness World's Record as the World's Whitest Paint.

Dr. Ronald Warzoha is currently an Associate Professor at the United States Naval Academy. Prior to his tenure at USNA, he served as a team lead for the Transformational Computing Thermal Management team at Northrop Grumman. He also spent a brief time at the Johns Hopkins Applied Physics Lab as a Senior Scientist, where his focus was on the development of novel shape memory alloy-based thermal storage materials and thermal camouflage systems. In his role at the USNA, he was awarded the Apgar Award for Teaching Excellence, given to one junior faculty member every two years. His research work recently earned him the ASME EPPD Early Career Engineer Award, and he is an Associate Editor for the ASME Journal of Electronic Packaging and the ASME Journal of Open Engineering. Dr. Warzoha has over 40 peer-reviewed journal articles, two patents, and has received major funding from the Office of Naval Research, the Joint Technologies Office, NRO, the Defense University Research Instrumentation Program. His work is presently funded by the National Institute of Standards and Technology (NIST) through the United States CHIPS Act.

Dr. Bidzina Kekelia's professional experience in engineering spans over 30 years and he has large number of publications on thermal management and clean energy technologies. Currently he is a Senior Research Engineer in the Advanced Power Electronics and Electric Machines (APEEM) Group within the Center of Integrated Mobility Sciences at the National Renewable Energy Laboratory (NREL). Since joining NREL in 2015, Bidzina's research efforts are focused on vehicle thermal management, exploring novel cooling methods for power electronics, and traction drives for ground electric vehicles (EV) and electrified aviation. Before coming to NREL, he was a postdoctoral research associate at the University of Utah, working on development of a thermal battery prototype for cabin climate control in electric vehicles.

Bidzina has also worked in the power generation and energy sector. Under the auspices of the U.S. Agency for International Development, he provided technical expertise and advisory support to the Ministry of Energy of Georgia. Bidzina developed a power generation dispatch optimization model to identify the export capacity of existing and proposed electricity production facilities in the country, prepared pre-feasibility techno-economic studies for attracting funding to major power sector projects, including high-voltage transmission line, hydropower plants, and provided consulting services and engineering oversight on several power sector-related rehabilitation projects.

Bidzina earned his Bachelor's (Hons) in Mechanical Engineering from Georgian Technical University (1992), M.S. in Renewable Energy (Solar Thermal & PV) from the University of Oldenburg (1999) and Ph.D. in Mechanical Engineering from the University of Utah (2012).

Dr. Solomon Adera is an Assistant Professor in the Mechanical Engineering Department at the University of Michigan. He received his MS and PhD from the Massachusetts Institute of Technology in 2012 and 2016, respectively. From 2016-2019, he was a postdoctoral researcher at the School of Engineering and Applied Sciences at Harvard University. His research interests include fundamental studies of micro/nanoscale heat and mass transfer, thermal management, fog/water harvesting, and solar-thermal energy systems. Solomon was the recipient of the National Science Foundation Graduate Research Fellowship Program from 2010-2013.

Dr. Prabhakar Subrahmanyam is a Senior Technical Lead and Senior Staff Principal Thermal Engineer at Intel, renowned for his expertise in thermal management from devices to data centers. He specializes in cooling at the silicon and package levels for post-silicon validation and broader strategies across the silicon chip ecosystem, including client, desktop, server, and AI silicon. Notably, he served as the chief validation thermal architect for the Ponte Vecchio chip, Intel’s first exascale GPU chip, which powers the Aurora supercomputer at the U.S. Argonne National Laboratory.

Dr. Prabhakar holds a PhD and Masters in Aerospace Engineering, with a focus on reentry heat transfer, as well as a first Masters in Computer Science and a Bachelors degree in Physics. He has authored over 60 papers and holds more than 50 patents in thermal management. His contributions have earned him 5 AIAA Best Paper Awards, 3 IEEE Best Paper Awards, and a gold medal for the best thesis.

In addition to his work at Intel, Dr. Prabhakar is a Visiting Professor at SRM University in India, where he established a lab for electronic cooling and teaches a Capstone program in Electronic Cooling, pioneering an industry internship within the classroom environment for undergraduate students.

Date: October 8, 9:30am – 10:45am Pacific Time
Location: California-Salon-A, Holiday Inn San Jose – Silicon Valley

Co-Chairs:

Nicholas Ginga, UAHuntsville
Rui Chen, Eastern Michigan University

Dr. Nick Ginga is an Assistant Professor in Mechanical and Aerospace Engineering at the University of Alabama in Huntsville. He obtained his Master’s and PhD degrees in Mechanical Engineering from Georgia Tech and has held postdoctoral research positions at The University of Michigan and Georgia Tech in both Mechanical Engineering and Biomedical Engineering. His research lab has interests that include mechanical testing and finite element modeling of flexible electronics and electronic packaging, thin film fracture mechanics, fabrication and characterization of nano/microstructures and devices, and the interface of nano/micro fabrication and biosystems.

Abstract: Reliability Evaluation of Additively Manufactured Stretchable Electronics: Research in the field of flexible and stretchable electronics has grown rapidly in recent years due to their applications in the fields of biomedical engineering, wearable electronics, consumer electronics, and the defense industry. The diverse materials used in stretchable electronics require different mechanical test requirements for their development compared to rigid electronics in order to replicate the unique multidirectional loadings that they experience during their use. This presentation will discuss the different classifications of flexible and stretchable electronics, the various materials and applications that are being used and investigated to create devices, specific methods that have been developed to test their mechanical reliability, and the mechanical modeling approaches to simulate their behavior while subjected to these unique loading scenarios.

Dr. Rui Chen is currently an Assistant Professor in the School of Engineering, Eastern Michigan University, specializing in Mechanical Engineering. She joined EMU in Fall 2023. Prior to this role, she was a Postdoctoral Fellow at the George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, from 2021 to 2023. Her research has been focused on design and modeling, fabrication, characterization, reliability assessment, and failure analysis of flexible electronics. Over the past six years, her interdisciplinary work has resulted in 19 journal and conference publications. Additionally, she is an active member of the Institute of Electrical and Electronics Engineers (IEEE), the Society of Women Engineers (SWE), and the American Society of Mechanical Engineers (ASME). She has been elected to serve as a member of the Thermal/Mechanical Simulation and Characterization Committee (TMSC) of the Electronic Components and Technology Conference (ECTC) of the Institute of Electrical and Electronics Engineers (IEEE). Dr. Chen received her Ph.D. degree in Mechanical Engineering from the Georgia Institute of Technology in 2021, her MS degree in Mechanics from the University of Chinese Academy of Sciences in 2015, and her BS degree in Engineering Mechanics from the Shanghai Jiao Tong University in 2012.

Abstract: Reliability Assessment of Additively Manufactured Flexible Electronics Under Bending: Flexible electronics, increasingly prevalent in wearable devices, soft robotics, and other advanced technologies, face significant reliability challenges under geometric deformations. While stretching is a common deformation these products may experience, bending presents more issues due to the more complex stress and strain distributions involved. This presentation will explore the specific challenges of maintaining the reliability of flexible electronics under bending conditions, including an overview of current challenges and methods used to assess reliability. It will cover the complexities introduced by bending, the associated failure modes, and methods for evaluating reliability, including experimental techniques, numerical simulations, and machine learning approaches. Additionally, the presentation will discuss future research directions aimed at addressing these challenges, such as developing more sophisticated modeling approaches to better capture the intricate electrical and mechanical relationships under bending and investigating novel materials and fabrication techniques to enhance reliability.

Insights from InterPACK 2024 Panels, Tutorials and Workshops

Date: October 9, 11:00am – 12:15pm Pacific Time
Location: California-Salon-K, Holiday Inn San Jose – Silicon Valley

Chair: Gamal Refai-Ahmed, AMD

Speakers:

Dr. Pushkar P. Apte, SEMI
Dr. Bahgat Sammakia, Binghamton University
Dr. Suresh Ramalingam, AMD
Dr. Pradeep Lall, Auburn University

Abstract: A special panel on "Silicon/Packaging Technology Development to Enable the Next Generation of AI," where distinguished executive leaders from industry and academia will explore the forefront of advancements revolutionizing AI hardware. This panel will reveal an exciting deep dive into the latest silicon and packaging innovations, examining how these technologies are transforming AI performance and efficiency. The expert panelists will unravel the complexities of advanced packaging techniques like 2.5D and 3D stacking, highlighting their critical role in overcoming challenges related to heat dissipation and signal integrity. Discover the importance of heterogeneous integration, the cutting-edge thermal management solutions, and the evolving role of materials science in semiconductor packaging. Engage with insights on how the industry is addressing higher interconnect density demands, the potential of silicon photonics, and the strategies balancing performance, power consumption, and cost in AI chip packaging. Additionally, the panel will explore the implications of a potential advancements, the role of machine learning in packaging optimization, and the significance of academia-industry collaboration in pushing technological boundaries. This panel is set to ignite audience curiosity and provide a comprehensive overview of the emerging technologies poised to disrupt the AI hardware landscape in the coming years. Don't miss this opportunity to gain invaluable knowledge and foresight from the leaders driving the future of AI technology.

Dr. Pushkar P. Apte serves as Strategic Technology Advisor and leads the Global Data & Artificial Intelligence (AI) Initiative at SEMI, the electronics industry consortium representing 3300+ companies worldwide. His work focuses on two exciting opportunities at the intersection of semiconductors and AI–innovative, system-level solutions to accelerate innovation in AI, and digital twins to improve efficiency of semiconductor research & development, design and manufacturing.

Dr. Apte received his Master's and Ph.D. degrees from Stanford University in Materials Science and Electrical Engineering, and his Bachelor's degree in Ceramic Engineering from the Indian Institute of Technology, Varanasi, India. Dr. Apte also holds an Executive M.B.A. from Southern Methodist University.

Until June 2024, Dr. Apte served as Director of Strategic Initiatives at the University of California, Berkeley, where he built industry-academic partnerships to create intelligent technology solutions for challenging business and societal applications. Previously, Dr. Apte has worked with Texas Instruments Incorporated on cutting-edge research and technology development for semiconductors, with McKinsey & Company as their Global Semiconductor Business Expert, and with the Semiconductor Industry Association as Vice President of Technology. Dr. Apte has served on the Executive Boards of the Semiconductor Research Corporation, International SEMATECH, and the International Technology Roadmap for Semiconductors.

Dr. Apte has over 50 publications and presentations in prestigious international journals, conferences, and institutions, including several Invited Papers. He has received the Norman Hackerman Young Author Award from the Electrochemical Society for Best Paper in the Journal of the Electrochemical Society, and the Graduate Student Award from the Materials Research Society for Outstanding Research Performance. Dr. Apte also holds 2 U.S. Patents.

Dr. Bahgat Sammakia is the vice president for research at Binghamton University and director of the NSF-IUCRC on Energy Smart Electronic Systems (ES2) and Binghamton University’s Small Scale Systems Integration and Packaging Center (S³IP), a New York State Center of Excellence. He is a professor of mechanical engineering in the Thomas J. Watson School of Engineering and Applied Science.

Dr. Sammakia has spent much of his research career working to improve thermal management strategies in electronic packaging systems at multiple scales ranging from devices to entire Data Centers.

Dr. Sammakia joined the faculty of the Watson School in 1998 following a fourteen-year career at IBM where he worked in the area of research and development of organic electronic systems. He has contributed to several books on natural convection heat transfer and is also the principal investigator or co-principal investigator on several cross-disciplinary research projects.

Dr. Sammakia earned his bachelor's degree in mechanical engineering from the University of Alexandria, Egypt, and his master's and doctorate in mechanical engineering from the State University of New York at Buffalo. He was a post-doctoral fellow at the University of Pennsylvania. Dr. Sammakia has over 200 published papers in refereed journals and conference proceedings, has contributed to several books in the areas of heat transfer and electronics packaging. He also holds 18 US patents and 12 IBM technical disclosures in the area of electronics packaging. Dr. Sammakia was the General Chair for the ITherm 2006 conference and the Interpack 2012 Conference. Dr. Sammakia is a Fellow of both the IEEE and the ASME and is the editor of the Journal of Electronic Packaging, Transactions of the ASME and an associate editor of the CPMT Transactions of the IEEE.

Dr. Suresh Ramalingam is a Corporate Fellow at AMD, where he leads the Advanced Packaging & Thermo-Mechanical Technologies sector. With a Ph.D. and M.S. in Chemical Engineering from MIT, and a B.Tech from IIT Madras, his extensive education has laid the foundation for over two decades of significant contributions in the semiconductor industry. Dr. Ramalingam's career began at Intel Corporation, where from 1994 to 2000, he developed advanced interconnect technologies and managed optical materials engineering. As a co-founder and Director of Materials at Scion Photonics from 2000 to 2002, he pioneered fiber-optic technologies until its acquisition by JDS Uniphase, where he then served as Senior Engineering Manager until 2004. His tenure at Xilinx from 2004 to 2022 saw him spearheading advanced packaging solutions for FPGAs, impacting 28nm technology developments significantly. Since 2022, at AMD, he focuses on enhancing silicon performance through innovative packaging and reliability improvements. Dr. Ramalingam has been recognized with numerous awards, including the ECTC 2011 Outstanding Session Paper and multiple keynote honors at prestigious IEEE conferences and other technical symposia worldwide, reflecting his leadership in integrating academic insights with industry applications to drive forward next-generation semiconductor technologies.

Dr. Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Samuel Ginn College of Engineering and Director of the Auburn University Electronics Research Institute. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering and the Department of Finance. He is a member of the technical council and academic co-lead of automotive and asset monitoring TWGs of NextFlex Manufacturing Institute. He is the author and co-author of 2-books, 15 book chapters, and over 975 journal and conference papers in the field of semiconductor packaging, electronics reliability, manufacturing, safety, testing, energy efficiency, and survivability. Dr. Lall is a fellow of the ASME, a fellow of the IEEE, a fellow of the NextFlex National Manufacturing Institute, and a fellow of the Alabama Academy of Science. He is recipient of the SEMI R&D Achievements Award for landmark contributions to Additive Printed Electronics, ASME Avram Bar-Cohen Memorial Medal, IEEE Biedenbach Outstanding Engineering Educator Award, Auburn University Research Advisory Board’s Advancement of Research and Scholarship Achievement Award, IEEE Sustained Outstanding Technical Contributions Award, NSF-IUCRC Association’s Alex Schwarzkopf Award, Alabama Academy of Science Wright A, Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, SMTA’s Member of Technical Distinction Award, Auburn University’s Creative Research and Scholarship Award, SEC Faculty Achievement Award, Samuel Ginn College of Engineering Senior Faculty Research Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Fifty Best-Paper Awards at national and international conferences. Dr. Lall has served in several distinguished roles at the national and international level including serving as a member of the National Academies Committee on Electronic Vehicle Controls, Member of the IEEE Reliability Society AdCom, IEEE Reliability Society Representative on the IEEE-USA Government Relations Council for R&D Policy, Chair of Congress Steering Committee for the ASME Congress, Member of the technical committee of the European Simulation Conference EuroSIME, Associate Editor for the IEEE Access Journal, and Associate Editor for the IEEE Transactions on Components and Packaging Technologies. Dr. Lall is the founding faculty advisor for the SMTA student chapter at Auburn University and a member of the editorial advisory board for SMTA Journal. He received the M.S. and Ph.D. degrees in Mechanical Engineering from the University of Maryland and the M.B.A. from the Kellogg School of Management at Northwestern University.

Date: October 8, 3:50pm – 5:15pm Pacific Time
Location: California-Salon-A, Holiday Inn San Jose – Silicon Valley

Moderator: Priyanka Dobriyal, AccessAI

Speakers/Mentors:

Narmadha Parhasarthy, Tensetorrent
Rui Chen, Eastern Michigan University
John D. Williams, Boeing

Dr. Priyanka Dobriyal is the founder/CEO of non-profit AccessAI under 5013c which aims to provide AI education free of cost. She has a very diverse technical experience from Intel most recently as a TA/Chief of Staff in Memory IO group in DCAI. Priyanka joined Intel in 2009 as a Process Engineer after completing her Ph. D from the University of Massachusetts, Amherst in the area of Polymer Physics. She has a MS in Chemistry from Indian Institute of Technology Roorkee. Priyanka is known in the industry for innovations through her publications (>10 Intel and external), technical and non-technical conference presentations and advocating for a diverse and an inclusive culture. She has 9 approved patent filings. In her spare time, Priyanka balances her fast-paced career with dedicated and heart-felt community service by organizing STEM outreach events.

Dr. John D. Williams: is a Technical Fellow and the lead engineer for Additive Electronics Manufacturing at Boeing Research and Technology (BR&T) in Huntsville, AL. John served as the science and technology lead for the Metal Micromachining effort at Sandia National Laboratories in ABQ (2004-2007). He later joined the University of Alabama in Huntsville as an Assistant Professor of Electrical, Materials, and Optical Engineering and Associate Director of the Nano and Micro Devices Center (2008-2014). Dr. Williams has 20 years of experience as a PI lead for prototype development of microelectromechanical systems (MEMS) with over 30 patents and 40 peer reviewed publications in the areas of materials processing, metals, microfabrication, photonics, and RF electronics and bioMEMS. Dr. Williams' research has been funded by NSF, DARPA, NASA, NIH, and US ARMY-SMDC. He has been a proposal author, PI, Co-PI, or PM on 14 NextFlex projects to improve manufacturing readiness of materials and processes to multilayer layer printing of DC electronics, antennas, and complex multilayer printed circuit boards for RF applications. As a NextFlex fellow, he has spoken at and led numerous NextFlex workshops, serves on the NextFlex Technical Council, has co-lead the NextFlex Materials Technical Working Group, and served on other working groups and committees for NextFlex since the first members meeting.

Workshops

Workshop 1: Status, Challenges, and Opportunities in Electronics Packaging from a Government/Lab Perspective

Workshop 2: K-16 Mentorship Workshop

Workshop 3: Reliability of Additively Manufacturing Flexible and Stretchable Electronics – Experiments, Models, and Applications

Workshop 4: Advancing Electronics Packaging and Heterogeneous Integration

Workshop 5: Women in Engineering