Semiconductor Packaging Laboratory

The Semiconductor Packaging Laboratory (SPACK) at Purdue University, led by Professor Tiwei Wei, focuses on addressing fabrication challenges in semiconductor packaging and assembly, as well as related heat transfer issues. The lab's research can be broadly categorized into two main areas:

1. Materials, Processing, and Architecture Development for Semiconductor Packaging: This involves investigating new thermal, mechanical stress, and electrical behaviors in scaling 3D interconnects or developing novel materials for vertical 3D interconnects.


2. Chip/Package Level Thermal Management: This includes electronic cooling techniques at both chip and package levels, such as jet cooling and microchannel cooling. It also encompasses surface engineering to enhance advanced cooling technologies, as well as thermal modeling, analysis, and management of advanced packaging solutions.