
Connect with Leaders Shaping the Future of Electronic and Photonic Packaging
Connect with industry experts, researchers, manufacturers, and decision-makers at InterPACK 2026, the premier international conference and exhibition focused on the packaging and integration of electronic and photonic microsystems.
As a sponsor or exhibitor, your company will connect with a focused technical audience working across microelectronics, thermal management, advanced packaging, reliability, AI hardware, photonics, and other emerging technologies.
Interested in becoming a sponsor or exhibitor? Review the opportunities below, then contact ASME to discuss the best package for your goals and confirm availability.
Why Sponsor or Exhibit?
InterPACK provides a unique platform to:
- Showcase your products, services, and technical expertise.
- Increase brand visibility among industry leaders and decision-makers.
- Generate qualified leads and business opportunities.
- Build relationships with researchers, practitioners, and potential customers.
- Demonstrate your commitment to advancing packaging and integration technologies.
Sponsorship Opportunities
InterPACK 2026 offers sponsorship packages designed to build visibility before, during, and after the conference, with options for companies seeking premium recognition, exhibit engagement, or a targeted brand presence.
Platinum Sponsor | $9,000
Elevate your brand with premier recognition throughout the conference, including high-visibility sponsor placement and exhibit hall presence.
Gold Sponsor | $7,000
Gain enhanced visibility and attendee engagement opportunities that position your company alongside industry leaders throughout the conference.
Silver Sponsor | $6,000
Increase your organization's presence with valuable branding and networking benefits.
Bronze Sponsor | $2,500
Establish your brand presence and connect with a highly specialized technical audience.
Custom Sponsorships
Looking for a tailored opportunity? ASME can work with your company to create a sponsorship package that aligns with your marketing goals, budget, and target audience. Custom branding, event support, and exclusive engagement opportunities may be available based on event needs and inventory.
Sponsor and Exhibit Prospectus
InterPACK 2026 will take place October 26-29, 2026, with the exhibition held October 27-29. The three-day exhibition connects exhibitors with engineers, researchers, and industry leaders attending the four-day conference in San Diego, California.
Download the Prospectus
Exhibition Information
Reach an international audience at InterPACK 2026
View the sponsorship and exhibit prospectus for package details, included benefits, and opportunities available for InterPACK 2026.
Included Exhibitor Benefits
All sponsorship packages include exhibitor benefits designed to maximize your visibility and attendee engagement:
- Tabletop exhibit space for the duration of the conference
- Up to two exhibit staff badges
- Company logo displayed on conference signage
- Logo placement within the conference app
- Sponsor recognition on the conference website
- Sponsor acknowledgement in the online conference program
- Half-page color advertisement in the online conference program
Exhibit space assignments are made on a first-come, first-served basis.
Who Attends InterPACK?
InterPACK attracts professionals and organizations from across the electronic and photonic packaging ecosystem, including:
- Semiconductor and microelectronics industries
- Electronic packaging and advanced manufacturing
- Photonics and optoelectronics
- Thermal management and cooling technologies
- Materials and reliability engineering
- Academia, research institutions, and government laboratories
- Technology solution providers and equipment manufacturers
Reserve Your Sponsorship
Secure your sponsorship or exhibit presence early to maximize visibility, confirm availability, and take advantage of pre-conference promotional opportunities.
Event Dates: October 26-29, 2026
Location: San Diego Marriott Mission Valley, San Diego, California, USA
Sponsorship agreements and exhibit details are available upon request. For sponsorship and exhibit inquiries, contact ASME at Exhibits@asme.org; Danielle Rojas, Manager, Conferences & Events, at RojasD@asme.org; or Ronald Warzoha, Sponsorship Chair, at warsoha@usna.edu.