InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2019 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
InterPACK 2019 will be held from October 7 – 9, 2019 at the Hilton Anaheim in Anaheim, CA, U.S.A. The Call for Abstracts is now out. We are currently accepting poster and technical presentation-only abstracts as well as abstracts for full-length technical papers.
To keep up with the tradition of past InterPACKs, we will heavily rely on participation and contribution from our community to fill out conference leadership, track and session chair positions. If you would like to contribute to the conference or need additional information, please contact the Conference General Chair, Sreekant Narumanchi, firstname.lastname@example.org. We look forward to seeing you in Anaheim, CA, in October of 2019!