iNPACK (a PCB Technologies subsidiary) offers s standard and customized IC packaging and substrate design, manufacturing and testing services. Combining subtractive and mSAP processes with our extensive materials knowledge, gives us the ability to solve many challenges such as CTE mismatches, thermal management issues, and more.
iNPACK provides SiP, semiconductor packaging, organic substrates (25µm lines and 25µm spacing), 3-D, 2.5-D and 2-D packaging solutions and also incorporates innovative interconnects as part of its substrate and micro- assembly process capabilities.
Our expertise is applied in aerospace, defense, medical, electronics, automotive, energy and communications industries worldwide.
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