21st International Conference on Advanced Vehicle Technologies (AVT)
The 21st International Conference on Advanced Vehicle Technologies will hold a Student Best Paper Award. The student-authored conference paper that best exemplifies research advances in ground vehicle engineering will receive the Student Best Paper Award. The award, which constitutes the Award recognition and a $500 cash prize, subject to availability of funds, is selected based on technical reviews and evaluations of the symposium organizers. The award recipient is encouraged to submit an enhanced version of the winning paper to the ASME Journal of Mechanical Design. To be considered for the AVT Student Best Paper Award, the paper must be submitted by the deadline February 25, 2019 by the standard ASME IDETC/CIE web upload. For more information, please contact Dr. Liangyao Yu, Tsinghua University, firstname.lastname@example.org.
39th Computers and Information in Engineering Conference (CIE)
The 39th Computers and Information in Engineering Conference (CIE) will hold the 2019 ASME-CIE Graduate Research Poster session. For further information, please contact Dr. Tsz Ho Kwok, Concordia University, email@example.com.
24th Design for Manufacturing and the Life Cycle Conference (DFMLC)
The 24th Design for Manufacturing and the Life Cycle Conference (DFMLC) committee invites students to attend the 2019 Design Tool Showcase. At this event, students and senior researchers will demonstrate practice-oriented innovations in design research with industry and academic members of the ASME community. This year’s design tool showcase will include posters, interactive demonstrations, and physical prototypes. We encourage you to actively engage with the presenters and the tools that they demonstrate. The list of design tools selected for the showcase will be posted after the review process is concluded. For further information, please contact Dr. Devarajan Ramanujan, Aarhus University, firstname.lastname@example.org.
43rd Mechanisms and Robotics Conference (MR)
The ASME Student Mechanism and Robot Design Competition (SMRDC), to be held by the 43rd Mechanisms and Robotics Conference (MR), is an excellent opportunity for both undergraduate and graduate students to showcase their ability to design and build a mechanism or robot. For inquiries regarding the SMRDC, please contact Dr. Brian Slaboch, Middle Tennessee State University, Brian.Slaboch@mtsu.edu, Dr. Nilanjan Chakraborty, University of Stony Brook, email@example.com, and Dr. Vishesh Vikas, University of Alabama, firstname.lastname@example.org.
15th International Conference on Multibody Systems, Nonlinear Dynamics, and Control (MSNDC)
The 15th International Conference on Multibody Systems, Nonlinear Dynamics, and Control (MSNDC) will hold the MSNDC Student Paper Competition.
A paper is eligible for the Student Paper Competition if its lead author is a student at the time of submission; that this individual is the presenting author; that there are no more than three authors; that the student is only submitting a single paper for consideration; and that the student’s advisor appears on at most two papers being considered for the competition.
Each paper will be reviewed by at least two reviewers who will each complete a scoring sheet, handled by the review coordinators for the technical symposium to which the paper was submitted.
The evaluated papers from each symposia will be provided to the MSNDC Student Paper Competition Committee. Of these top-scoring papers, no fewer than four and no more than eight will undergo a second review and scoring, by a different and independent set of three reviewers appointed by members of the Committee. The six papers with the highest aggregate score will be selected as finalists for oral presentations in the Student Paper Competition session. The session will be held on the first day of IDETC/CIE MSNDC and chaired by a member of the Committee. Finalists will be informed of their selection one month prior to the conference.
To participate in the Competition, the paper must be submitted as a Technical Paper Publication by the time of the deadline for full-length paper submission. For further information, please contact Dr. James R. Chagdes, Miami University, email@example.com, and Dr. Mohammad Pourina, University of Arizona, firstname.lastname@example.org.
31st Conference on Mechanical Vibration and Noise (VIB)
The Technical Committee on Vibration and Sound (TCVS) Student Paper Competition will be held at the 31st Conference on Mechanical Vibration and Noise (VIB). Three best paper prizes will be awarded at most, and the winners will be announced during a ceremony including other TCVS awards at IDETC/CIE. The deadline for submitting manuscripts to be considered for the Student Paper Competition will be the same as the deadline for the general sessions, and all manuscripts submitted will be available to the TCVS Student Paper Awards Committee for review.
To be eligible for the Student Paper Competition, the manuscripts must be submitted to the VIB conference tracks, at which time, the authors must express their interest in being considered for the student paper competition. The first author of a paper must be a student at the time of submission; a first author student cannot be an author of more than one paper in the competition. A faculty adviser cannot be a co-author in more than two papers in the student paper competition. Manuscripts with more than three authors are not eligible for the student paper competition. The student manuscripts will be scored by three anonymous reviewers. Between 3 to 10 manuscripts will be selected as finalists by the members of the TCVS Student Paper Awards Committee, which will subsequently convene to select the first, second, and third place awardees. The awardees will be informed of their selection in advance of the 2019 IDETC/CIE.
For further information regarding the TCVS Student Paper Competition, please contact Dr. Fabio Semperlotti, Purdue University, email@example.com.
The Technical Committee on Vibration and Sound (TCVS) will also support student travel to the 2019 IDETC/CIE for students who are first authors on submissions as Technical Paper Publication, Technical Presentation, or Student Competition Paper submitted to the VIB Conference. Travel support will be in the form of a partial reimbursement of travel expenses. The reimbursement will be provided after completion of the travel and conference participation. For full application information, please contact Dr. Ryan L. Harne, The Ohio State University, firstname.lastname@example.org.
NSF/ASME Student Design Essay Competition
To encourage students to think about the future of engineering design and the intellectual foundations which are essential for the development of the field, NSF and ASME are sponsoring a student design essay competition. Winners are invited to attend the 2019 ASME Design Technical Conference (IDETC) in Anaheim, California, and will receive reimbursement for expenses up to a maximum of $1,500. For further information on the opportunity, contact Dr. Janet K. Allen, University of Oklahoma, email@example.com.
Student Team Design Competition
The Student Team Design Competition is open to all student attendees of the 2019 IDETC/CIE. Tuesday evening 20 August 2019, of the IDETC/CIE, students are encouraged to team up for a fast-paced 30-minute Design Challenge. Creativity and innovation of the Design Challenge projects will be evaluated by judges, and top ranked teams will be awarded prizes. Refreshments will be provided at the Design Competition, graciously donated by the ASME Design Engineering Division. The location of the Design Competition will be announced with the release of the IDETC/CIE program.