Panels

 

Jeffrey Ewanchuk, PhD

Talk Title: Opportunities in High Voltage Power Module Packaging with Additive Manufacturing

Abstract: Electrification is an ongoing trend to mitigate the contribution of the aviation industry to the global carbon emissions. As a result, the onboard power systems are increasing in terms of the total power, and the specific power densities of the various power distribution and power electronic components must also increase to make this trend economically viable. One solution to increase the onboard power system specific power density is to increase the distribution voltage. However, operation at high voltages at high altitude poses significant packaging issues for the various power electronic components. In this talk, the role of the power module package for highly integrated power converters is established, and the challenges at > 1 kV operation are highlighted for modern power module packages. Elements of the power module package suitable for additive manufacturing are addressed from the state of the art to establish the various areas of opportunity motivated by these application challenges. Lastly, a mixed material additive manufacturing technique is presented to achieve a thin power substrate with high thermal performance with low electric field stress at the triple points within the power module.

Biography: Jeffrey Ewanchuk received the B.Sc. degree (with distinction) in electrical engineering, M.Sc. degree with a specialization in power electronics, and a PhD degree in Energy Systems from the University of Alberta, Canada, in 2006, 2008 and 2012, respectively. From 2008 to 2009, he was a Design Engineer with RMS Welding Systems, Nisku, Canada. In 2012, he joined Mitsubishi Electric Research Centre Europe (MERCE) in Rennes, France as a Research Engineer in power electronics, afterwards taking position as a Senior Staff Research Engineer in 2015. In 2017, he took over the role of Research Manager at MERCE, where he led a team investigating reliable power packaging technology. Since 2019, he has been a Principal Engineer in Power Electronics Packaging with the Research Center at Raytheon Technologies, in East Hartford, USA. His current research interests include highly integrated power converters, additive manufacturing, high density packaging concepts, and the design consequences on the power converter lifetime and robustness.

 

Dr. Mike M. Mekhiche, Spellman High Voltage Electronics

Talk Title: How Can 3D Printing Enhance Power Electronics Design and Performance?

Abstract: TBD

Biography: Dr. Mike M. Mekhiche is the Global Vice President of Engineering Technology at Spellman High Voltage Electronics. Mike brings over 25 years of technology and product development, qualification and commercialization in the defense, aerospace and commercial markets. He was the Deputy Director at Rolls-Royce Electrical (RRE) before joining Spellman High Voltage, where he led the specific mission to enable Rolls-Royce to be a major leader in the “third era of aviation” by developing the required business capability, technologies, products and infrastructure to industrialize and commercialize electric and hybrid electric power generation and propulsion systems for aerospace applications and other market sectors. Prior to RRE, he was the Executive Vice President, Engineering and Operations for Ocean Power Technologies where he led the development, validation, commercialization and production of innovative ocean based electric power generation systems for the oil & gas, defense and communications markets. He also held positions with increasing responsibilities at BAE Systems where he was Director of Programs, Technology and Products. At BAE Systems, Mike started as a Chief Engineer for Power Systems defense and commercial markets, and subsequently earned his full Global Engineering Fellowship and progressed to a business executive and leadership role. He also held a variety of other leadership positions in large organizations such as DRS Technologies where he was the Technical Director and Chief Engineer for the US Navy’s future combatant ship propulsion system program where he led the development, testing and qualification of naval combat ship electric propulsion systems. Mike combines a breadth of demonstrated business acumen, program management, market development, new product introduction strategies and a strong technical and technology expertise background. He holds a Masters and PhD in Electrical Engineering.

 

Dr. Scott N. Schiffres, Binghamton University

Talk Title: Cooling Electronics Better thru Direct Printing of Cooling Features

Abstract: TBD

Biography: At Binghamton University, Scott’s research is at the intersection of heat transfer, energy and additive manufacturing. Scott has received support from the NSF, SRC, NYSERDA and IEEC. Scott is a 2019 NSF CAREER Recipient in the Thermal Transport Processes program. Prior to joining the faculty at Binghamton University in January 2016, Scott was a postdoctoral associate at Massachusetts Institute of Technology, where he worked on energy-efficient adsorption refrigeration with Prof. Evelyn Wang, and heat transfer applications of nanomaterials and additive manufacturing with Prof. Anastasios John Hart. In 2014, Scott received his PhD in mechanical engineering from Carnegie Mellon University, working in the area of experimental nanoscale heat transfer with Prof. Jonathan A. Malen. In 2010, Scott was awarded a Steinbrenner Institute Research Fellowship.

Scott spent the summer of 2012 as a visiting researcher at Profs. Junichiro Shiomi and Shigeo Maruyama's laboratory at the University of Tokyo through a joint U.S.-Japan East Asia Pacific Summer Institute Fellowship. Before returning to academia in the fall of 2009, he worked as a flight and controls engineer at Boeing's Satellite Development Center in Los Angeles. Scott graduated from Princeton University in 2006 with a BSE in mechanical and aerospace engineering and a certificate in robotics and intelligent systems, and from Cornell University with a MEng in mechanical engineering in 2007.

 

Dr. Ryan O'Hara, nTopology, Technical Director Aerospace and Defense

Talk Title: Leveraging Implicit Geometry and Iterative Design Techniques to Maximize Heat Transfer

Abstract: In the aerospace industry, the transport of heat is critical to meeting the system’s performance requirements. In many applications, the current generation of thermal management systems is insufficient to meet future applications due to the increased thermal output of advanced avionic systems and the high weight and lower heat rejection capabilities of these decades-old thermal management systems. A new approach to heat exchanger design using implicit geometry allows a user to encapsulate shape, physics, and manufacturing processes in a single unified environment. Engineers can now overlay CAD geometry, simulated and empirical engineering data, and manufacturing process knowledge to design advanced, knowledge-driven, thermal solutions that scale from the lab to production. Implicit modeling technology enables a step-change improvement in speed & complexity utilizing an advanced platform that gives thermal design engineers control over their data and integrations so that they can deliver high-performance products over short timelines to meet the demands of these advanced aerospace systems. Utilizing implicit modeling and advanced manufacturing it is now possible to generate geometry with incredibly high surface areas for a given volume and large increases in thermal performance. Further, by coupling implicit modeling with advanced design exploration tools, like machine learning and artificial intelligence, it is possible to design optimal thermal solutions in timelines and configurations that were previously unimaginable. This presentation will demonstrate how this new approach to heat exchanger design has been currently demonstrated on an advanced heat exchanger with application to the aerospace, oil and gas, and chemical industries.

Biography: Dr. Ryan P. O'Hara is currently serving as the Technical Director for Aerospace and Defense at nTopology. Dr. O'Hara joined nTopology in April 2019 after 20 years of military service in the United States Air Force as a Developmental Engineer. His technical focus is on the application of Mechanical Structures and Structural Dynamics to Aerospace Systems. Areas of interest include turbine engines, laminate composites, meta-materials, and additive manufacturing. Prior to starting at nTopology, he was in academia as an Assistant Professor in the Department of Aeronautics and Astronautics at the US Air Force Institute of Technology.

 

Dr. Matthew Harrison, The Aerospace Corporation

Talk Title: Early Career Lessons on Cryocooler Landscape and Cryogenic Thermal Margins

Abstract: Modern spacecraft utilize sensitive sensors with tight thermal margins. As programs continue to optimize spacecraft design the use of cryocoolers continues to change. Increasingly important characteristics include size and cost. Which is leading many programs to integrate multiple smaller cryocoolers to meet the thermal demands. This presentation will cover early career lessons on cryogenic thermal margins, integration challenges, and current cryocooler landscape.

Biography: Dr. Matt Harrison attended Oklahoma State University where he received his bachelors of Mechanical Engineering in 2015. He then attended Oregon State University and graduated in 2020 with his Masters and Ph.D. also in Mechanical Engineering. While at Oregon State his research was primarily focused on high heat flux electronics cooling. This led to the creation of a collegiate overclocking group where LN2 was the primary coolant used for high performance computing competitions. For his dissertation he experimentally measured and analytically modeled the net coolant flow rate of a boiling fluid to a high heat flux surface. In August of 2020 he joined The Aerospace Corporation as a Thermal Controls Engineer and member of the technical staff. Since he joined The Aerospace Corporation he has worked on active and passive cooling solutions for spacecraft. He also has been actively researching ways to mitigate vibrations from external disturbances induced from multiple cryocoolers in a single payload.

 

Dr. Joshua Gess, Oregon State University

Talk Title: Pitfalls and Challenges in Cryogenic Overclocking

Abstract: Electronics like to run cold, but how cold is too cold? Cryogenics can keep electronics at temperatures where leakage currents are near minimum, and the inherent phase change these coolants undergo ensures that the underlying components are certainly energy-dense. However, issues from thermal expansions are exacerbated and system complexity (most importantly size) increases as well. There are trades to be made in this space which means there is valuable research to be conducted and discoveries to be made. This presentation will cover advances made in cryogenic cooling with a focus on computer overclocking and extremely low temperature compatible packaging.

Biography: Dr. Joshua Gess is an Assistant Professor at Oregon State University (OSU) in Thermal Fluid Sciences. He was recognized as a 2019 Outstanding Student Branch Counselor for his leadership of OSU Overclocking, a student group focused on applying thermal management principles learned in the classroom to competitive computer overclocking. Dr. Gess was the winner of 2020 ASME K-16 Early Faculty Career in Thermal Management Award. He is the Competition Chair for the annual ASME K-16 and IEEE EPS co-sponsored Student Design Challenge where students from around the world submit their best heat sink designs made with Additive Manufacturing. Dr. Gess is also the coach of the OSU Rolling Beavers Wheelchair Basketball team and a former MVP of the Auburn University Wheelchair Basketball Team.

 

Mr. Howard Tseng, NASA Goddard Space Flight Center

Talk Title: Closed Loop Cryogenic Cooling in Spaceborne Applications

Abstract: In the not so distant past, getting down to cryogenic temperatures meant using a stored cryogenic fluid. Even though this was effective, it also meant there was a finite amount of time associated with operating at that temperature. In the last few decades, there have been rapid and major developments of technologies that helped our field to move away from using stored cryogens as the working medium. We will look at the lessons learned through those advances, as well as the new challenges to tackle in the future.

Biography: Howard Tseng attained his Bachelor of Science in Civil Engineering from the University of California, Berkeley in May of 2000. After working overseas for a year and half developing gas turbine engines for power generation, he returned to the US to start graduate school in September 2002 at the University of California, Los Angeles. Howard’s research project was studying the effect of flowing a colloidal gas aphrons (CGA) solution on heat transfer in mini-channels. After completing his Master’s of Science in Mechanical Engineering in June of 2004, he joined the Jet Propulsion Laboratory (JPL) as a full-time employee in the Cryogenic Systems Engineering group. While working at JPL Howard also completed his MBA degree in May of 2013 from UC Berkeley Haas School of Business. During his time at JPL, Howard’s duties have included thermal conductivity testing of materials and components from 3 K to 300 K, thermal design and modeling of spacecraft and instruments, and new technology development and maturation for space application. Some of Howard’s past projects have been Moon Mineralogy Mission (M3), Orbital Carbon Observatory (OCO), Ultra Compact Imaging Spectrometer (UCIS), and flexible graphene thermal strap development and qualification. Currently, Howard is working in the Cryogenics and Fluids Branch at the Goddard Space Flight Center. Howard’s technical interests include developing unique and new cooling architecture for instruments and spacecraft as well as creating tools to help engineers be more efficient.

 

Dr. Husam Alissa, Microsoft

Talk Title: Liquid Cooling Ecosystem for the Cloud

Abstract: The chip industry is running into limits of all scaling laws (Moore’s and Dennard’s). A new generation of chips and architectures with superior performance and monetization per VM is required. Those new architectures will include higher densities systems that will have higher power and cooling demand. Liquid cooling technology is one of the pillars for unlocking next generation HW.

Biography: Dr. Husam Alissa is a principal engineer & technical lead in Microsoft’s Data Center Advanced Development Team. His focus areas include systems (chip-server-data center), cooling (air, direct to chip, immersion, and cryogenics), performance, architecture, reliability, efficiency, sustainability, and TCO, with more than fifty publications in these fields. Husam’s work has received many recognitions including NewYork state assembly early career achievement, ASME InterPACK Outstanding paper award, IEEE TCPMT Electronics Packaging Society Best Paper Award, and S3IP distinguished doctorate dissertation award. Husam is a member of IEEE, ASHRAE TC9.9, ASME, OpenCompute and iMasons.

 

Dr. Ashish Gupta, Intel

Talk Title: Benefits and Challenges of Deploying Different Liquid Cooling Technologies in Data Centers

Abstract: With the advancement of Moore’s law, server CPUs have been able to utilize more and more every process generation. With increasing core count, demand for power increases to deliver higher overall performance and higher performance/core. Increasing power trend of server CPUs is pushing air cooling to its limits. As fan power approaches about 15% of total server power budget, it is no longer energy efficient to cool servers with air and alternate liquid cooling options must be considered. As part of this panel discussion, the speaker will discuss both benefits and challenges of deploying different liquid cooling technologies in datacenters. Both cold plate based liquid cooling and immersion based liquid cooling will be covered. Various standardization efforts to accelerate development and deployment of liquid cooling technologies will be covered.

Biography: Dr. Ashish Gupta is the Senior Director of Thermal Mechanical Solution group at Intel Corporation. His group is responsible for developing thermal and mechanical engineering in support of the Data Center and Artificial Intelligence product roadmap. In his career, Ashish has managed numerous engineering teams across various US, Latin America, and Asia sites. Ashish has 9 patents and has published more than 80 papers at Intel and outside. Ashish holds a Ph.D. in Mechanical Engineering from Purdue University, USA and was awarded with Outstanding Mechanical Engineer award by Purdue University in 2020.

 

Dr. Ali Heydari, NVIDIA

Talk Title: High Heat Density Liquid Cooling of Data Centers

Abstract: Artificial intelligence and machine learning applications are about to permanently change design of data centres where liquid will be coming closer than ever as the common medium to cool the core of computational servers from GPU, CPU, Switch and other components. Hybrid air and liquid cooling with direct to chip cooling design is going to be the low hanging fruit of choice for designers where liquid will be used to directly cool high heat density components while air will continue to cool other components. Design of Liquid plumbing, selection of cooling distribution units, selection of compatible wetted materials list and reliability/serviceability issues are some of the challenges that industry is striving to resolve as we see more data centres preparing to embrace liquid for cooling servers and other IT equipment.

Biography: Dr. Ali Heydari is Distinguished engineer and Data Center Technologist at Nvidia in charge of all data center technology development at Nvidia. In this role, he is developing direct to chip cooling technologies using cold plates, cooling distribution units and manifolds for cooling of Nvidia’s high heat density using single and two phase refrigeration cooling systems. Prior to Nvidia, he worked as senior director in charge of Rigetti’s Quantum Computers using the most futuristic technology in today's data center compute. Accomplishments include, setting up the first Quantum Cloud Services enabling over the cloud access of the Quantum Computers. Prior to that he served as Senior Technical Director and Chief Data Center Architect at Baidu, the largest search engine and AI company in China. In this role, he was server and data center architect in charge of hardware and data center design, development and deployment in China’s largest data center search and AI company. He was responsible for development of cutting edge data center and server hardware technology such as IDEC and free air-cooled data center design, high power density server rack design, liquid cooling of GPU/CPU servers and liquid cooled heat exchanger rack and data center solutions for achieving extremely low data center PUE/WUE at Baidu’s data centers in China. Formerly, he was Senior Hardware Engineer at Twitter where he was responsible for grounds up development of Twitter's data center ODM server development. Earlier, he was Senior Hardware Engineer at Facebook where he helped in developing Facebook's original OCP server and data center products. Prior to that he worked at Sun Microsystems and spend about 10 years as Associate Professor of Mechanical Engineering at Sharif University of Technology in Iran. He received his B.S. in mechanical engineering from University of Illinois, Urbana, M.S., Ph.D. in mechanical engineering and M.A. in applied mathematics from University of California, Berkeley. He has over 25 issued patents in data center cooling technologies.

 

Dr. Saket Karajgikar, Facebook

Talk Title: Liquid Cooling – Easier Said Than Done

Abstract: Industry had witnessed a rapid development in areas such as AI/ML which has raised cooling challenges compared to other storage/network platforms. This requires data centers to be more flexible than ever which may house several different technologies under one roof. This talk will briefly discussed how requirements are changing and thus raising the complexity of building and operating a large scale infrastructure that can include hybrid cooling.

Biography: Dr. Saket Karajgikar is a lead R&D Engineer at Facebook with a focus on emerging technologies to address short and long term data center needs. Leveraging his experience in developing thermal solutions at both data center and at HW level, he is responsible for developing and adopting technologies which are both efficient and environmentally less disruptive.

 

Dr. Jorge Padilla, Google

Talk Title: Enabling Liquid Cooling at Scale

Abstract: The talk will focus on the end-to-end challenges of liquid cooling at scale to include demonstration of repeatable thermal-hydraulic performance, reliability, quality, and scaling with suppliers/vendors in a still nascent industry.

Biography: Dr. Jorge Padilla is a Staff Mechanical Engineer at Google where, since 2014, he has developed and delivered end-to-end, chip-to-chiller thermal technologies at scale for thermal management of data center IT equipment. He has co-chaired technical sessions at the ASME InterPACK and Itherm conferences since 2017. He has published in ASME conference proceedings, peer-reviewed journals and is a co-inventor on 9 issued US patents. Prior to joining Google, he earned a PhD in mechanical engineering from the University of California, Berkeley where he focused on water droplet vaporization from nanostructured surfaces in the Energy and Multiphase Transport Laboratory led by Prof. Van Carey. He holds a bachelors of science degree in mechanical engineering from MIT.

 

Dr. Jackson B. Marcinichen, JJ Cooling Innovation

Talk Title: The Real Impact of Loop Thermosyphon Cooling Systems in the Next Generation of Electronics

Abstract: In the last decade several passive cooling systems were developed, experimentally tested and proved to be an excellent and reliable choice for applications were high heat flux must be dissipated from electronics. Nowadays, the main challenge seems to be more related to the acceptability of the electronic industry for this new disruptive cooling technology, which means investment in a new production strategy considering the passive system integrated and the measurement of the cost-benefit at the end of the selling process.

Biography: J.B. Marcinichen is founder and CEO of JJ Cooling Innovation and has over 30 years of experience in HVAC & R systems. He received his PhD in Mechanical Engineering from the Federal University of Santa Catarina, Brazil in 2006. He has authored over 60 scientific and technical papers in indexed journals and international peer-reviewed conferences, book chapters and patents. He is mainly engaged in the development of novel hybrid cooling systems (passive and active) to cool high heat flux electronics using on-chip cooling. He received the IEEE Best Paper Award at the ITHERM 2020 conference (USA, 2020).

 

Professor Tassos Karayiannis, Brunel University

Talk Title: Flow Boiling in Microchannels for Cooling Small-Scale High Heat Flux Devices

Abstract: Spatially non-uniform and unsteady dissipative heat generation in high heat flux devices used in a number of applications is detrimental to their performance and lifetime constituting, at the same time, a bottleneck for further development. Flow boiling in microchannels constitutes one of the best options for cooling such devices, promising to meet requirements >1 MW/m2 since it can (i) yield very high heat transfer coefficients due to the dissipation of latent heat; (ii) maintain a uniform surface temperature, vital for the correct operation of components; and (iii) respond passively to alleviate localised “hot-spots”, as the heat transfer coefficient increases with heat flux. The presentation will include latest research findings in this area, highlighting both fundamental and practical aspects of the use of microchannels.

Biography: Tassos Karayiannis leads the Two-Phase Flow and Heat Transfer Group and is Director of the Energy Efficient and Sustainable Technologies Research Centre at Brunel University, London. He carried out extensive experimental work in pool boiling heat transfer, including heat transfer enhancement and flow boiling in small to micro tubes and micro-multi-channels for over 35 years and published more than 250 book chapters, papers and industrial reports. He is the Chairman of the UK Nat. Heat Transfer Committee.

 

Fred Buining, HIRO-MicroDataCenters

Talk Title: The Multidimensional Challenge of Achieving Cost Efficiency, Reliability, High Density and Cooling Hardware at the Edge

Abstract: GDPR, latency, privacy, security, fault tolerance requirements draw Big Data and AI processing back from the Cloud to the Edge. Edge IT infrastructure however spreads out over factories, cities, buildings and is exposed to conditions very different from the managed data center space. To create cost efficient yet reliable high performance in these conditions is a multidimensional challenge to HIRO-MicroDataCenters. Innovating in cooling technology is one of the key success factors in achieving this.

Biography: Fred has 30 years of experience in Industrial Innovation across various industries and ICT related technologies incl. robotics, autonomous driving, vision technology, embedded computing. He is the founder of HIRO-MicroDataCenters, a start-up developing Edge services supporting Big Data processing and AI in factories, cities, hospitals, etc. HIRO-microdatacenters are mobile, with unprecedented high density 1.5kW shoebox size-150kW rack size, composable with any mix and quantity (CPU, FPGA, GPU, NVMe) and come with a complete stack for Edge services (storage, compute, acceleration, networking) and virtualization (Containers and VM's). The hardware based on Industry standards is completely solid state, no moving parts, including the cooling, thereby saving upto 40% in IT energy consumption.

 

Dr. Victor Chiriac, GCTG LLC

Talk Title: Heterogeneous Integration for 5G High Performance Computing – Cooling Challenges and Opportunities

Abstract: There is a critical need for heterogeneous system integration for systems-in-a-package (SiPs) for the 5G High Performance Computing (HPC) and to identify potential solutions for short to long term challenges to design these SiPs. Aside from the processor- memory performance gap that remains a key driver for the overall system architecture, new factors that drive the need for heterogeneous integration in the HPC and data center markets have been emerging. These include cooling technology limitations, new and emerging applications, and scaling needs for power delivery and dissipation, also package level IO constraints. Some of these challenges and opportunities will be discussed.

Biography: A fellow of the American Society of Mechanical Engineers (ASME) since 2014, Dr. Victor Adrian Chiriac is a co-founder and a managing partner with the Global Cooling Technology Group since 2019. He previously held technology/engineering leadership roles with Motorola (1999-2010), Qualcomm (2010 - 2018) and Huawei R&D USA (2018 - 2019). Dr. Chiriac was elected Chair of the ASME K-16 Electronics Cooling Committee (2013-2017) and was elected the Arizona and New Mexico IMAPS Chapter President in 2010. He is a leading member of the organizing committees of ASME/InterPack, ASME/ IMECE and IEEE/CPMT ITherm Conferences, also a co-editor of the highly popular Electronics Cooling magazine. He holds 19 U.S. issued patents, 2 US Trade Secrets and 1 Defensive Publication (with Motorola) and has published over 107 papers in scientific journals and at conferences.

 

Professor William P. King, University of Illinois at Urbana-Champaign

Talk Title: Ultra-power dense heat exchanger enabled by shape optimization and additive manufacturing

Abstract: This talk describes the development of power dense heat exchangers using shape optimization and additive manufacturing. Using generative design and a genetic algorithm, we demonstrate the design of a dual tube device with separate liquid streams flowing through either side of the device. The device was additively manufactured in aluminum silica (AlSi10Mg) and then tested under both laminar and turbulent flow conditions. The shape optimized device shows significant increase in heat transfer rate and power density when compared to devices having either no fins or conventional straight fins.

Biography: William P. King, Ph.D. is Professor and Ralph A. Andersen Endowed Chair in the University of Illinois Urbana-Champaign Grainger College of Engineering, Department of Mechanical Science and Engineering. He holds courtesy appointments in the Departments of Electrical and Computer Engineering and Materials Science and Engineering, as well as in the Department of Biomedical and Translational Biosciences in the Carle Illinois College of Medicine. Dr. King is the Chief Scientist at Fast Radius, a company that sells software-driven manufacturing. In 2018, the World Economic Forum named Fast Radius as a Lighthouse Factory, one of the world’s best digital factories. Dr. King was the founding Chief Technology Officer at the Digital Manufacturing and Design Innovation Institute (DMDII) at UI LABS in Chicago, IL, now known as MxD. DMDII was one of the first institutes in the U.S. National Network for Manufacturing Innovation. Dr. King’s awards include the PECASE award from the White House and the ASME Gustus-Larson Award for accomplishment in Mechanical Engineering. Dr. King has published 250 journal articles and 19 patents. He is a Fellow of the American Society of Mechanical Engineers, American Association for the Advancement of Science, and the American Physical Society.

 

Professor David Huitink, University of Arkansas

Talk Title: Additive Manufacturing for Electronics Thermal Management

Abstract: With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional heat sinks and cold plates to adequately dissipate heat. Secondly, higher frequency switching in high voltage, high current, wide bandgap power modules is creating intensified electromagnetic interference challenges, in which metallic heat removal systems will couple and create damaging current ringing. Furthermore, mobile power systems (such as in electrified aircraft) require lightweight heat removal methods that satisfy the heat loads dissipated during operation. In this effort we introduce an additive manufacturing pathway to produce custom heat removal systems using non-metallic materials, which take advantage of impinging fluid heat transfer to enable efficient thermal management. Herein, we leverage the precision of additive manufacturing techniques in the development of 3D optimized flow channels for achieving enhanced effective convective heat transfer coefficients. The experimental performance of convective heat removal due to liquid impingement is compared with conventional heat sinks, with the requirement of simulating the heat transfer needed by a high voltage inverter. Thermal and hydraulic performances will be discussed, along with the demonstration of this cooling approach in a high frequency T-type inverter intended for electrically driven aircraft propellers. The implementation of non-metallic materials manufacturing is aimed to reduce electromagnetic interference in a low weight and reduced cost package, which are presented using modeling and experimental validation of common mode noise induced by high voltage switching characteristics.

Biography: Professor Huitink's research portfolio spans the intersection of materials and thermal sciences, where fundamental thermophysical material behaviors can be leveraged for engineered applications. Herein, the interplay between atomic bonding, polymorphism, & nanoscale interactions with thermal transport, generation and storage have important implications in energy sciences, thermally active and functional materials, and materials processing. In particular, the Huitink lab works closely with Electrical Engineering collaborators in developing next generation, high density power electronics for electrified transportation and power conversion systems, and leverages advances in materials and thermal technologies for enabling High-Reliability electronics packaging. Recent efforts include use of additive manufacturing for hot-spot thermal management and transient temperature abatement, as well as interconnect fabrication technology development for enhanced lifetimes of electronic packaging through thermal cycling events. Moreover, the reliability efforts include developing novel methods for observing and isolating the physical mechanisms behind material degradation and failure in materials used in high power, high voltage electronic assemblies. Prior to joining Academia, Professor Huitink spent more than 5 years in industry, working in microelectronics technology development and manufacturing at Intel Corporation, where he served as Quality & Reliability Engineering Program Manager for Intel's Custom Foundry Division. There he pioneered the development of advanced methods of predicting reliability of silicon-based flip chip microelectronic packages, as well as developed testing protocols and FEA methods for governing Design for Reliability (DfR) guidance. Additionally, he has patent applications filed in Low Z-height Electronic System design and thermal optimization of space limited electronic systems. Recently, Professor Huitink also served as an Associate Editor of Microelectronics Reliability Journal. Prior to his industry experience, Dr. Huitink received his PhD in Mechanical Engineering from Texas A&M University as a NSF Graduate Research Fellow, working on complex nano-scale interactions at material interfaces under chemical and mechanical influence.

 

Darin Sharar, PhD, U.S. Army Research Laboratory (ARL)

Talk Title: Recent Developments in Active Cooling and Passive Thermal Energy Storage Systems

Abstract: This discussion covers ongoing efforts at the Army Research Lab, and academic/industry partners, to develop state-of-the-art active cooling and passive thermal energy storage systems. The discussion begins with a description of emerging electronic/opto-electronic steady-state and transient load scenarios, followed by limitations of traditional thermal management approaches, and progresses to recent advances in high centrifugal force flow boiling and high-capacity high-power thermal storage owing to unique implementations of additive manufacturing and metallic solid-solid phase change materials. Focus is placed on emerging cooling technologies and anticipated future needs for improved materials, modeling tools, and manufacturing approaches.

Biography: Dr. Sharar is a Research Scientist and Team Lead in the Energy and Power Branch within the U.S. Army Research Laboratory (ARL). Research efforts reside at the intersection of materials science, additive manufacturing, numerical modeling, thermal metrologies, and active/passive heat transfer to enable future high-power electronic/photonic capabilities. He is principle investigator and sponsor for several tri-service, industry, and academic efforts aimed towards accelerating adoption of emerging additive manufacturing-enabled cooling and thermal storage approaches. He received his Ph.D. from the University of Maryland, College Park in Mechanical Engineering in 2016 under the guidance of the late Dr. Avram Bar-Cohen. He has authored/co-authored over 55 journal papers, refereed proceedings papers, and book chapters with nearly 400 peer citations; has delivered 20 research and invited lectures at major technical conferences and institutions; and has authored 5 U.S. patents.

 

Terry Hendricks

Talk Title: Transitioning Nanotechnology to the Space & Terrestrial Power - Thermal Nexus for 2021 and Beyond – Nanotechnology to Astronomical Systems

Abstract: Project Manager leading and managing complex, multi-disciplinary projects to: 1) Develop next-generation aircraft energy recovery technologies using advanced heat exchangers, integrated with advanced thermoacoustic generators and heat pipe technologies; 2) Develop Solar Array Dust Mitigation technologies; 3) Develop a thermoelectric power system design for unmanned aircraft (UAV) engine energy recovery applicable to different UAV platforms; and 4) Characterize and quantify pyroshock-driven dynamic effects on Radioisotope Thermoelectric Generator power output, thereby reducing risk on Mars 2020 spacecraft.

Biography: Dr. Hendricks is currently an ASME Fellow, IEEE Senior Member and retired from NASA–Jet Propulsion Laboratory (JPL) / California Institute of Technology. While at JPL, he was responsible for designing spacecraft thermal and propulsion systems, solar power systems, radioisotope power systems, thermal management and thermal energy storage systems critical to NASA missions. Among his numerous awards, he was recently inducted into the University of Texas at Austin Mechanical Engineering Academy of Distinguished Alumni. He also has been nominated for the Eni 2020 Energy Frontiers Award in Rome/Milan, Italy for his innovative work in terrestrial energy recovery. He has over 40 years of professional expertise in thermal & fluid systems, nano-scale and micro-scale heat transfer, energy recovery, energy conversion and storage systems, terrestrial & spacecraft power systems, micro electro-mechanical systems, and project management. His extensive expertise is embodied in 3 book chapters published by Taylor and Francis and Elsevier; and over 100 reports, conference papers, and journal articles in the Journals of Electronic Materials; Energy; Materials Research; Heat Transfer; Thermophysics and Heat Transfer; and International Heat & Mass Transfer. Dr. Hendricks holds 9 patents and is a Registered Professional Engineer in California and Texas.

 

Dr. Jihwan An, SeoulTech

Talk Title: Atomic Layer Deposited Nanomaterials for Energy Conversion and Storage Devices

Abstract: With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional heat sinks and cold plates to adequately dissipate heat. Secondly, higher frequency switching in high voltage, high current, wide bandgap power modules is creating intensified electromagnetic interference challenges, in which metallic heat removal systems will couple and create damaging current ringing. Furthermore, mobile power systems (such as in electrified aircraft) require lightweight heat removal methods that satisfy the heat loads dissipated during operation. In this effort we introduce an additive manufacturing pathway to produce custom heat removal systems using non-metallic materials, which take advantage of impinging fluid heat transfer to enable efficient thermal management. Herein, we leverage the precision of additive manufacturing techniques in the development of 3D optimized flow channels for achieving enhanced effective convective heat transfer coefficients. The experimental performance of convective heat removal due to liquid impingement is compared with conventional heat sinks, with the requirement of simulating the heat transfer needed by a high voltage inverter. Thermal and hydraulic performances will be discussed, along with the demonstration of this cooling approach in a high frequency T-type inverter intended for electrically driven aircraft propellers. The implementation of non-metallic materials manufacturing is aimed to reduce electromagnetic interference in a low weight and reduced cost package, which are presented using modeling and experimental validation of common mode noise induced by high voltage switching characteristics.

Biography: Jihwan An is an Associate Professor in the Department of Manufacturing Systems and Design Engineering at Seoul National University of Science and Technology (SeoulTech), Korea since 2014. Before SeoulTech, he worked as a research associate and lecturer in the Department of Mechanical Engineering at Stanford University. He received his MS and PhD degrees in Mechanical Engineering from Stanford University in 2009 and 2013, respectively, and BS degree in Mechanical and Aerospace Engineering from Seoul National University in 2007. Current research interests: nanoscale phenomena in solid oxide fuel cells and thin film processes with current focus on atomic layer deposition (ALD) process.

 

Professor Nenad Miljkovic, UIUC

Talk Title: Fundamental Challenges to Structured Surface Implementation with Real Thermal Systems

Abstract: Almost a century ago, the concept of ‘dropwise condensation’ was proposed, which states that steam condensation on hydrophobic surfaces can enhance heat transfer by up to 10 times compared to traditional 'filmwise condensation'. The potential of dropwise condensation has driven researchers to design thin (≈100 nm-thick) hydrophobic coating materials. However, the lack of long-term (>5 year) durability has been the main hindrance to coating utilization over the past century. In this talk, I will present our most recent progress in designing thin and durable hydrophobic coating materials for stable dropwise condensation. I will then cover design guidelines and challenges of creating durable and scalable surface structures for stable pool and flow boiling. Next, I will briefly discuss how micro/nanoengineered materials can be scaled up and applied to real life meter-scale industrial equipment through rational nanomanufacturing considerations. For anti-icing heat exchanger applications, we show that nanostructuring of the aluminum surface can delay frosting by 3x and increase overall heat pump system efficiency by 50%. Finally, I end my talk by briefly discussing novel approaches and use cases for structured surfaces, including: high temperature braze flow control in manufacturing, low and high temperature fouling, and advanced thermal management of power electronics.

Biography: Dr. Nenad Miljkovic is an Associate Professor of Mechanical Science and Engineering at the University of Illinois at Urbana-Champaign (UIUC). He has courtesy appointments in Electrical and Computer Engineering, and the Materials Research Laboratory. He is the Associate Director of the Air Conditioning and Refrigeration Center (ACRC), which is supported by 30 industrial partners. His group’s research intersects the multidisciplinary fields of thermo-fluid science, interfacial phenomena, scalable nanomanufacturing, and renewable energy. He is a recipient of the NSF CAREER Award, the ACS PRF DNI Award, the ONR YIP Award, a Distinguished Visiting Fellowship from the UK Royal Academy of Engineering, a U.S. NAS Arab-American Frontiers Fellowship, the ASME ICNMM Young Faculty Award, the ASME Pi Tau Sigma Gold Medal, the CERL R&D Technical Achievement Award, the UIUC Dean’s Award for Excellence in Research, the US Army Corps of Engineers ERDC R&D Achievement Award, the SME Young Faculty Award, the Bergles-Rohsenow Young Investigator Award in Heat Transfer, and is a Kritzer Faculty Scholar at the University of Illinois.

 

Dr. Jorge Padilla, Google

Talk Title: Scaling Nanomaterials Technology Beyond the Lab for Adoption in Data Center Applications

Abstract: The talk will focus on the criteria for adoption of nano research technologies in the hyperscale DC industry, i.e. demonstrating repeatable performance, reliability, quality, and scaling the technology beyond the lab environment with industrial partners.

Biography: Jorge Padilla is a Staff Mechanical Engineer at Google where, since 2014, he has developed and delivered end-to-end, chip-to-chiller thermal technologies at scale for thermal management of data center IT equipment. He has co-chaired technical sessions at the ASME InterPACK and Itherm conferences since 2017. He has published in ASME conference proceedings, peer-reviewed journals and is a co-inventor on 9 issued US patents. Prior to joining Google, he earned a PhD in mechanical engineering from the University of California, Berkeley where he focused on water droplet vaporization from nanostructured surfaces in the Energy and Multiphase Transport Laboratory led by Prof. Van Carey. Jorge holds a bachelor of science degree in mechanical engineering from MIT.

 

Dr. Todd Salamon, Nokia Bell Labs

Talk Title: Impact of 5G on Thermal Management of Telecommunications Networks

Abstract: Network operators are beginning the buildout of 5G wireless networks, with the enhanced bandwidth and extremely low latency of 5G networks anticipated to enable a range of applications, including self-driving cars, industrial automation, and digital health, to name a few. The demands that 5G applications will place on network infrastructure require continued innovations in wireless and wireline technologies. As one example, the low latency requirements of 5G-enabled applications is resulting in the emergence of so-called “edge” computing, where compute and data resources are located in small-scale data centers that are near the end user or application, with high-speed radio access networks (RANs) providing the needed application bandwidth. In this talk, I will discuss telecom industry trends brought on by 5G, how such trends are impacting the design of networks and devices, and the associated implications for thermal management in telecommunications networks.

Biography: Todd R. Salamon received the Ph.D. degree in chemical engineering from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA. He is currently a Member of Technical Staff in the Hybrid Integration Research Group, Nokia Bell Labs, Murray Hill, NJ, USA, where he has worked on thermal management, microfluidics, transport phenomena in optical fiber manufacturing, design of photonic crystal fibers, and Raman and erbium amplifier dynamics and control in transparent optical networks. He has authored over 60 publications and conference presentations and holds 36 issued or pending patents. He was the Principal Investigator on a U.S. Department of Energy project titled “Advanced Refrigerant-based Cooling Technologies for the Information and Communications infrastructure” to develop and commercialize refrigerant-based cooling technology targeting the Information and Communications Technology (ICT) sector, and a Team Member of the MIT-lead DARPA ICECool Fundamentals Program.

 

Dr. Y.C. Lee, Kelvin Thermal

Talk Title: Foldable Thermal Ground Planes

Abstract: Foldable thermal ground planes (TGPs) are enabling components for more powerful foldable smartphones, laptop PCs, ARs/VRs, and other systems with varying configurations in real time. We will present testing results on our foldable TGPs with a bending radius of 3mm and 150,000 folding cycles. More importantly, we will illustrate how to improve foldable system’s power dissipation by at least 3X with the use of the foldable TGPs.

Biography: Dr. Y. C. Lee is the President and CEO of Kelvin Thermal. He is retired from the University of Colorado Boulder in August 2021. Dr. Lee received the ASME InterPACK Achievement Award in 2013. He was the Editor of ASME Journal of Electronic Packaging from 2015 to 2020.

 

Prof. Yogendra Joshi, Georgia Tech

Talk Title: Microfluidic Thermal Management for Heterogeneously Integrated Microsystems

Abstract: Heterogeneous integration is bringing in several thermal challenges. Two examples will be presented to illustrate these and some potential solutions. Power delivery to high performance computing hardware requires internal voltage regulators (IVR), which employ package embedded passive elements such as inductors. Close proximity of the passives and IVR requires independent thermal management of the passives. The passives are embedded within the packaging structure and do not have direct access to thermal management. The second example considers glass interposer based packaging of 5G and beyond mm wave wireless modules. Embedding of components within the interposer is a promising technology for compact heterogeneous integration. Thermal management of components such as power amplifiers for glass interposer based packaging presents significant challenges. As discussed, microfluidics presents promising solutions for both applications.

Biography: Yogendra Joshi is Professor and John M. McKenney and Warren D. Shiver Distinguished Chair at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. His research interests are in multi-scale thermal management. He is the author or co-author of over four hundred publications in this area, including over two hundred journal articles. He is an elected Fellow of the ASME, the American Association for the Advancement of Science, and IEEE.

 

Dr. Ravi Mahajan, Intel Corp.

Talk Title: Thermal Management in Devices in Thermally Demanding Environments

Abstract: The context for the thermal problem for some of the devices and applications addressed by this panel is provided. A call for action on developing thermal solutions is made and opportunities for collaboration are identified.

Biography: Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel’s EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award For Excellence and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE.

 

Professor John R. Thome, GCTG LLC

Talk Title: Pulsating Heat Pipe for Cooling of Mobile Electronics

Abstract: Pulsating heat pipes (PHPs) are a new high performance cooling solution for mobile electronics: tablets, phones, portable PCs, etc. Presently, a newly developed planar PHP has been developed with a very thin form factor (< 1.0mm thickness) that handles one or multiple distributed thermal cooling loads up to and beyond 30W. Some test results and IR thermal images will be presented to illustrate the thermal performance in various cooling orientations (vertical and horizontal) and in steady-state/transient operation..

Biography: John R. Thome is Co-Founder and Technical Director of Global Cooling Technology Group in Phoenix, AZ developing pulsating heat pipe technologies for the mobile and commercial electronics market as well as JJ Cooling Innovation in Lausanne, Switzerland, a micro-two-phase cooling technology development company for numerous other industries. Has 20+ years of experience with development of micro-two-phase cooling systems for electronics (pumped systems, thermosyphons, pulsating heat pipes and high fidelity simulators for them). He is the author of five books and is editor-in-chief of the Encyclopedia of Two-Phase Heat Transfer and Flow (16 volumes). He received the 2017 Nusselt-Reynolds Prize, the 2019 IEEE ITHERM Award and the 2019 ASME InterPack Medal, the ASME Heat Transfer Division's Journal of Heat Transfer Best Paper Award in 1998, the United Kingdom’s Institute of Refrigeration J.E. Hall Gold Medal in 2008, the 2010 ASME Heat Transfer Memorial Award, among others.

 

Hiroyuki Ryoson, Dexerials (ex-Sony Chemicals)

Talk Title: Low Thermal Resistance 3D Stacked IC Using WOW Technology

Abstract: Recently stacked DRAM is commercialized in response to the demand for increasing DRAM capacity, and it uses microbump technologies for stacking. When using microbump method, the thermal resistance in interlayer and in BEOL are large, so that total thermal resistance is larger. As the result total the temperature rise between top layer and bottom layer of stacked dies is large. At this point Tokyo institute of Technology reports the bumpless stacking technologies. When this method is used via last technology and the total thermal resistance is small, the temperature rise is also small. The total thermal resistance in microbump method is 1.54 K/W and the temperature rise at 22.6 W input power is 19.9 C. On the other hand, the total thermal resistance method in bumpless method is only 0.46 K/W and the temperature rise at 22.6 W input power is only 5.8 C.

Biography: Hiroyuki Ryoson is the Dexerials Executive Chief Engineer responsible for thermal management technology and thermal management materials. Ryoson is also a researcher of Tokyo Institute of Technology responsible 3D stacking technology development. He was also a member of Sony corporation responsible for thermal management technology development.

 

 

Professor Bahgat Sammakia, SUNY Binghamton

Biography: Professor Bahgat Sammakia is the vice president for research at Binghamton University and director of the NSF-IUCRC on Energy Smart Electronic Systems (ES2) and Binghamton University’s Small Scale Systems Integration and Packaging Center (S³IP), a New York State Center of Excellence. He is a professor of mechanical engineering in the Thomas J. Watson School of Engineering and Applied Science. Dr. Sammakia has spent much of his research career working to improve thermal management strategies in electronic packaging systems at multiple scales ranging from devices to entire Data Centers. Dr. Sammakia joined the faculty of the Watson School in 1998 following a fourteen-year career at IBM where he worked in the area of research and development of organic electronic systems. He has contributed to several books on natural convection heat transfer and is also the principal investigator or co-principal investigator on several cross-disciplinary research projects. Dr. Sammakia earned his bachelor's degree in mechanical engineering from the University of Alexandria, Egypt, and his master's and doctorate in mechanical engineering from the State University of New York at Buffalo. He was a post doctoral fellow at the University of Pennsylvania. Dr. Sammakia has over 200 published papers in refereed journals and conference proceedings, has contributed to several books in the areas of heat transfer and electronics packaging. He also holds 18 US patents and 12 IBM technical disclosures in the area of electronics packaging. Dr. Sammakia was the General Chair for ITherm 2006 conference and Interpack 2012 Conference. Dr. Sammakia is a Fellow of both the IEEE and the ASME and is the editor of the Journal of Electronic Packaging, Transactions of the ASME and an associate editor of the CPMT Transactions of the IEEE.

 

Dr. Suresh Ramalingam, Xilinx

Biography: Dr. Suresh Ramalingam graduated in 1994 with a Ph.D. in Chemical Engineering from Massachusetts Institute of Technology, Cambridge. He holds 32 US Patents, 2013 SEMI Award, Ross Freeman Award for Technical Innovation, ECTC 2011 Conference Best Paper Award, IMAPS 2013 and 2014 Conference Best Paper Awards for 2.5D/3D and book chapter on 3D Integration in VLSI Circuits. He started his career at Intel developing Organic Flip Chip Technology for Micro-processors which was implemented on Pentium II (Intel's first flip chip product) in 1997. As one of the co-founders and Director of Packaging Materials at Scion Photonics he helped develop DWDM modules used by major communication companies. JDS Uniphase acquired Scion Photonics in 2002. As a Xilinx Fellow, he currently manages Advanced Packaging Interconnect Technology Development including TSV/3D for Xilinx FPGA products. Thermal Enablement and Board/System Level is a key focus area to push the power/performance envelope under the leadership of Dr. Gamal Refai-Ahmed and happy to be a partner in crime supporting the necessary technology pieces. Suresh has more than 40 Patents, 35+ publications, VLSI Circuits Book Chapter on 3D Integration.

 

Dr. Ravi Mahajan, Intel Fellow

Biography: Dr. Ravi Mahajan is an Intel Fellow and the Director of Pathfinding for Assembly and Packaging technologies for 7-nanometer (7nm) silicon and beyond in the Technology and Manufacturing Group at Intel Corporation. He is responsible for planning and carrying out multi-chip package pathfinding programs for the latest Intel process technologies. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. Ravi joined Intel in 1992 after earning a bachelor’s degree from Bombay University, a master’s degree from the University of Houston, and a Ph.D. from Lehigh University, all in mechanical engineering. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME and IEEE 2019 “Outstanding Service and Leadership to the IEEE” Award for both the Phoenix Section & IEEE Region 6. He is an IEEE EPS Distinguished Lecturer. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. Additionally he has been long associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE. He was named an Intel Fellow in 2017.

 

Dr. Krishna Darbha, Microsoft Senior Director

Biography: Dr. Krishna Darbha is GM of Reliability at the Microsoft Devices Business Group (MDG) at Microsoft. He has been w/ Microsoft for the past 20 years and is currently responsible for Reliability of Surface. He has managed Reliability of many complex multi-physics consumer electronic products and worked on products like Xbox, PCHW peripherals, Zune and Surface Table Top. Prior to Microsoft he was with IBM in the Microelectronics Division responsible for multi-physics analysis of cutting-edge microelectronic modules. He obtained his Ph.D. in Mechanical Engineering from the University of Maryland (College Park) in 1999. He covers Reliability through the entire product life cycle starting from up-front product development relying on quantification of user scenarios, efficient virtual qualification techniques, qualification of supply-chain, development of acceleration models for new failure modes, demonstration of reliability goals and quality assurance via ORT and other CTQ monitors in mainstream production. He is a member of ASME and IEEE and contributed through publishing and reviewing papers in conferences and journals for over 20 years. He currently holds more than 15 patents and Patents Pending.

 

Abhinav Saxena, PhD, GE Research

Talk Title: Use of AI and ML in Industrial Reliability Engineering

Abstract: This talk will discuss application and use cases for ML and AI to improving reliability for industrial applications. Some successful AIML examples in industrial domain will be presented that may have direct applicability to electronics systems. Current research directions and challenges from industrial perspective will be shared.

Biography: Dr. Abhinav Saxena is a Principal Scientist in AI & Learning Systems at GE Research. Abhinav has been developing ML/AI-based PHM solutions for various industrial systems (aviation, nuclear, power, and healthcare) at GE and has been driving integration of AI-based PHM analytics in GE's industrial systems. Abhinav is also an adjunct professor in the Division of Operation and Maintenance Engineering at Luleå University of Technology, Sweden. Prior to GE, Abhinav was a Research Scientist with SGT Inc. at NASA Ames Research Center for over seven years. Abhinav’s interests lie in developing PHM methods and algorithms with special emphasis on deep learning and data-driven methods in general for practical prognostics. Abhinav has published over 100 peer reviewed technical papers and has co-authored a seminal book on prognostics. He actively participates in several SAE standards committees, IEEE prognostics standards committee, and various PHM Society educational activities, and is a Fellow of the PHM Society. He is also the chief editor of International Journal of Prognostics and Health Management since 2011 and actively participates in organization of PHM Society conferences.

 

Professor Mark Fuge, University of Maryland College Park

Talk Title: Machine Learning Generative Models for Power Electronics Design and Reliability

Abstract: will review some of the advances and challenges in using Machine Learning techniques—specifically, Deep Generative Graph Models—to accelerate the design and evaluation of Power Converter circuits as part of the ARPA-E DIFFERENTIATE program. In particular, I will focus on one key idea that underlies the success of generative models more broadly: the embedding of high-dimensional design spaces into low-dimensional manifolds. I'll describe how this applies to power electronics design, but also the broader relevance of this to other engineering design challenges, with potential examples from aerospace engineering, material science, and medical devices. I will also discuss some of the practical challenges with deploying these techniques in industrial settings where available data size and quality are limited, as well as potential research and development opportunities that result from these challenges.

Biography: Dr. Mark Fuge is an Associate Professor of Mechanical Engineering at the University of Maryland, College Park, where he is also an affiliate faculty in the Institute for Systems Research and a member of the Maryland Robotics Center and Human-Computer Interaction Lab. His staff and students study fundamental scientific and mathematical questions behind how humans and computers can work together to design better complex engineered systems, from the molecular scale all the way to systems as large as aircraft and ships using tools from Computer Science (such as machine learning, artificial intelligence, and submodular optimization) and Applied Mathematics. He received his Ph.D. from UC Berkeley and has received an NSF CAREER Award, a DARPA Young Faculty Award, and a National Defense Science and Engineering Graduate (NDSEG) Fellowship. He gratefully acknowledges prior and current support from NSF, DARPA, ARPA-E, NIH, ONR, and Lockheed Martin, as well as the tireless efforts of his current and former graduate students and postdocs, upon whose coattails he has been graciously riding since 2015. You can learn more about his research at his labs website.

 

Professor Payman Dehghanian, George Washington University

Talk Title: Distributed Intelligence for Online Situational Awareness and Resilience in Electric Power Grids

Abstract: The electricity grid is constantly exposed and vulnerable to fast- and slow-dynamic threats ranging from unpredictable faults, weather-driven natural disasters, malicious cybersecurity attacks, and other random disruptions. With the growing demand to ensure higher quality electricity to end customers and mission critical systems and services, there is an urgent need to enrich the power delivery infrastructure resilience against disruptive events while reducing and mitigating such threatening risks. This calls for derivation and fundamental advancements of new, fast, and efficient analytical frameworks embedded in modular and localized solutions for online situational awareness and real-time decision making. This presentation seeks to provide analytical foundations to design, develop, and test next-generation smart sensors embedded with artificial intelligence and signal processing algorithms for online situational awareness in cyber-physical smart grids. Going beyond the traditional centralized monitoring paradigms, which are vulnerable to communication failures, delays, and cyber-attacks, the proposed solution for system monitoring and control paradigms enables fusing the online measurements in a distributed manner, translating the data to valuable information closer to where it is generated, i.e., distributed intelligence. Enabling a paradigm shift from sensing-only to sensing-and-actuating apparatus at the grid edge, the proposed solution would prepare the smart grids for a wide range of slow and fast-dynamic events while minimizing the disastrous consequences of such threats and maximizing its resilience to emergencies.

Biography: Dr. Payman Dehghanian is currently an Assistant Professor at the Department of Electrical and Computer Engineering at George Washington University, Washington DC, USA. He received his Ph.D. degree from the Department of Electrical and Computer Engineering at Texas A&M University in 2017. He received a B.Sc. and M.Sc. degrees both in Electrical Engineering respectively from the University of Tehran, Tehran, Iran in 2009 and the Sharif University of Technology, Tehran, Iran, in 2011. His research interests include power system resilience and reliability assessments, synchrophasor technology, and smart electricity grid applications. Dr. Dehghanian is the recipient of the 2016 Best Engineering Graduate Student in the State of Texas, the 2015 IEEE-HKN Outstanding Young Electrical Engineer Award, the 2014 and 2015 IEEE Region 5 Outstanding Professional Achievement Awards, and the 2021 Washington Academy of Sciences Early Career Award. In 2015 and 2016, he was also selected among the World's Top 20 Young Scholars for Next Generation of Research in Electric Power Systems.

 

Dr. N. Jordan Jameson, Johns Hopkins University

Talk Title: Don't Forget About 'Good, Old-Fashioned' Statistics

Abstract: As computing power becomes ubiquitous and incorporating machine learning (ML) and artificial intelligence methods becomes more convenient, it is easy to forget about statistical methods. However, these methods are powerful. Markov chains can enable efficient modeling of system operational regimes and application conditions; Monte Carlo methods can help us model and reproduce parametric and non-parametric data distributions, leading to e.g., better estimation of component/system parameters; and hypothesis testing is invaluable to generating useful features for application in AI/ML modeling. While it is blissful to believe that we can throw data at a deep neural network and let it sort out the modeling, this is ultimately naïve. Success demands that we use all tools at our disposal, and traditional statistical tools often have the edge when it comes to computational efficiency and interpretability.

Biography: Dr. N. Jordan Jameson is a data scientist working at Johns Hopkins University Applied Physics Laboratory in Cyber Systems Warfare group within Asymmetric Operations Sector. He has also worked as a data scientist at the National Geospatial-Intelligence Agency (NGA), and a manufacturing systems prognostics and health management (PHM) engineer at the National Institute for Standards and Technology (NIST). He holds a PhD in mechanical engineering from the University of Maryland, College Park, where he studied prognostics and health management methods within the Center for Advanced Life Cycle Engineering (CALCE).