Skip to content
Provided by ASME Logo The American Society of Mechanical Engineers

InterPACK® 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Virtual Conference, Online

Virtual Conference: October 26 – 28, 2021

View Final Program

Announcements

Save the date! The video submission deadline is August 16, 2021. Other important information for authors and presenters is available.

We would like to thank the family of Nasser Grayeli for their sponsorship, continued support and contribution to the Nasser Grayeli Best Student Poster Awards.

ASME will hold open help center calls to offer on the spot technical support for the new tool.

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2021 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

 

InterPACK 2021 Tracks:

  • Track 1: Heterogeneous Integration of Electronic Packages
  • Track 2: Data Centers, Servers of the Future, Edge and Cloud Computing
  • Track 3: Flexible and Wearable Electronics
  • Track 4: Power Electronics
  • Track 5: Multiscale Heat Transfer in Optics and Energy Systems
  • Track 6: Autonomous, Hybrid, and Electric Vehicles
  • Track 7: Reliability of Electronic Packages and Systems
  • Track 8: Nano-Scale Thermal Transport and Materials
  • Track 9: Posters
  • Track 10: Keynotes, Workshops and Panels

Important Dates

  • Notification of Abstract Acceptance
    March 22, 2021
  • Abstract Submission
    March 29, 2021
  • Submission of Full-Length Paper for Review
    May 07, 2021
  • Paper Acceptance Notification & Electronic Copyright Process Opens
    June 17, 2021
  • Submission of Revised Papers
    July 01, 2021
  • Submission of Presentation Only Abstract
    July 05, 2021
  • Notification of Acceptance for Revised Papers
    July 08, 2021
  • Final Paper Submission
    July 16, 2021
  • Author Notification of Presentation Only Abstract Acceptance
    July 19, 2021
  • Submission of Video and Speaker Release Form
    August 16, 2021

Sponsors