InterPACK® 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

As the Coronavirus (COVID-19) continues to be a global issue, ASME is monitoring developments on a daily basis including recommended guidelines from the Centers for Disease Control and Prevention (CDC) and the World Health Organization (WHO). Our primary concern is the health and safety of those who attend our conferences and meetings. We have decided to cancel the in-person ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems scheduled on October 27 – October 29, 2020, at the Hilton Anaheim in Anaheim, CA, and transition to a Virtual Conference.

ASME regrets having to make this change, but the safety of our participants is our utmost priority.

In addition to our informative Virtual Conference program, we will offer the opportunity for each paper presentation to be uploaded to our virtual site, for viewing either during the virtual program or on-demand following the event. In order to ensure that we have the widest dissemination possible of the conference proceedings, at least one author per paper must register to attend the Virtual Conference. This is similar to ASME's "no show" policy with our regular conferences, so papers without an author attending the virtual conference will be pulled from the official proceedings. As with our physical conferences, registrants of the virtual conference will receive full access to the conference proceedings. Virtual Conference registration fees will be sharply discounted from the regular conference fees.

We encourage you to check this website regularly for further news. Thank you for your understanding. We hope you will join us at the Virtual Conference.