The deadline to submit abstracts for InterPACK2020 is February 6, 2020.
In addition to paper presentations and exhibits, InterPACK 2020 will include panel discussions, workshops, tutorials, keynotes and technology talks, and a poster session.
ASME will hold open help center calls to offer on the spot technical support for the new tool.
As the Coronavirus (COVID-19) continues to be a global issue, ASME is monitoring developments on a daily basis including recommended guidelines from the Centers for Disease Control and Prevention (CDC) and the World Health Organization (WHO). Our primary concern is the health and safety of those who attend our conferences and meetings. We have decided to cancel the in-person ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems scheduled on October 27 – October 29, 2020, at the Hilton Anaheim in Anaheim, CA, and transition to a Virtual Conference.
ASME regrets having to make this change, but the safety of our participants is our utmost priority.
In addition to our informative Virtual Conference program, we will offer the opportunity for each paper presentation to be uploaded to our virtual site, for viewing either during the virtual program or on-demand following the event. In order to ensure that we have the widest dissemination possible of the conference proceedings, at least one author per paper must register to attend the Virtual Conference. This is similar to ASME's "no show" policy with our regular conferences, so papers without an author attending the virtual conference will be pulled from the official proceedings. As with our physical conferences, registrants of the virtual conference will receive full access to the conference proceedings. Virtual Conference registration fees will be sharply discounted from the regular conference fees.
We encourage you to check this website regularly for further news. Thank you for your understanding. We hope you will join us at the Virtual Conference.
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2020 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
- Track 1: Heterogeneous Integration: Micro-Systems with Diverse Functionality
- Track 2: Servers of the Future, Edge and Cloud Computing
- Track 3: Flexible and Wearable Electronics
- Track 4: Optics and Photonics
- Track 5: Power Electronics
- Track 6: Multiscale Energy Transport, Conversion, and Storage
- Track 7: Autonomous, Hybrid, and Electric Vehicles
- Track 8: Industry, National Laboratory, and Academia Posters
Submission of Full-Length Paper for Review
May 26, 2020
Author Paper Review Complete
June 15, 2020
Copyright Process Opens
June 19, 2020
Draft Paper Acceptance Notification (copyrights issued upon acceptance of draft)
June 19, 2020
Submission of Revised Papers
July 10, 2020
Acceptance of Revised Papers
July 15, 2020
Submission of Presentation Only Abstract
July 16, 2020
Author Notification of Presentation Only Abstract Acceptance
July 23, 2020
Copyright Submission Deadline
July 24, 2020
Submission of Final Paper
July 27, 2020