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Provided by
The American Society of Mechanical Engineers
InterPACK® 2020
Virtual Conference,
Online
Virtual Conference: October 27 – 29, 2020
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/InterPACK-2020/Program-2
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AI Workshop
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Career Development Workshop
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Heterogeneous Integration Roadmap Workshop
Journal of Electronic Packaging
Mentorship Workshop
Open Compute Project Workshop
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Video: Heterogenous Integration Challenges & Opportunities
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/InterPACK-2020/Register
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/InterPACK-2020/Sponsor-Exhibit
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Sponsor Prospectus
Bronze Sponsor
Penn State College of Engineering
Penn State Materials Research Institute
University of Texas at Arlington
Gold
Intel
Program Cover Page Advisement
World Scientific Publishing Company
Silver Sponsor
ASME Journal of Electronic Packaging (JEP)
Google
Novark
NREL
Stanford nanoHeat
TDK
Student Sponsor
University of Texas at Arlington
