Skip to content
Provided by ASME Logo The American Society of Mechanical Engineers

Open Compute Project Workshop

Date and Time: Wednesday, October 28, 2020, from 10:50 AM to 12:20 PM

Organizers: Jimil M. Shah and Saket Karajgikar

Details: The Open Compute Project Foundation is a rapidly growing, global community whose mission is to design, use, and enable mainstream delivery of the most efficient designs for scalable computing. The members of the community believe that openly sharing ideas, specifications, and other intellectual property is the key to maximizing innovation and reducing complexity in tech components. The Open Compute Project Foundation provides a structure in which individuals and organizations can share their intellectual property, research, ideas etc. with others and encourage the industry to evolve. At heart OCP promotes open collaboration for the industry/academia to share their insights and evolve as a community.

The organizers of the workshop would like to invite you all to learn more about OCP and their initiatives. During the workshop, our esteemed speakers will talk about inception of OCP, mechanics of OCP and some of the key project initiatives such as Data Center Facilities, Rack and Power, Advance Cooling Solutions and Open Domain-Specific Architecture (ODSA).


10.50 AM – 10.55 AM – Welcome and Introduction, Dr. Jimil M. Shah
10:55 AM – 11:10 AM – Inception and Background of OCP, Mr. Dharmesh Jani
11:10 AM – 11:25 AM – Mechanics and key projects, Mrs. Archna Haylock
11:25 AM – 11:40 AM – Data Center Facilities, Mr. Rob Coyle
11:40 AM – 11:55 AM – Rack and Power and Advance Cooling Solutions, Mr. Caleb Lusk
11:55 AM – 12:10 PM – Open Domain-Specific Architecture (ODSA), Dr. Bapi Vinnakota
12:10 PM – 12:20 PM – Collaboration opportunities and Concluding remarks, Dr. Saket Karajgikar


Jimil Shah

Jimil M. Shah is an Application Development Engineer for server liquid cooling of data centers at 3M Company. His research is in the area of advanced cooling solutions for data center thermal management with a focus on single- and two-phase direct-to-chip and immersion cooling. Prior to joining 3M, Dr. Shah was the Post-Doctoral Research Associate at the University of Texas at Arlington. Dr. Shah received his PhD in Mechanical Engineering from the University of Texas at Arlington in 2018 and is a professional member of IEEE, ASHRAE TC9.9, ASME and OpenCompute. In InterPACK 2018, he received the “ASME Electronics and Photonics Packaging Division (EPPD) Student Engineer of The Year Award”. He is the recipient of the 2018 UTA College of Engineering Summer Dean’s Dissertation Fellowship and spring 2018 UTA I-Engage Mentoring Program Scholarship. He has also received the “Best Student Abstract Award” at IMAPS 2015, Los Gatos, CA. He has published 24 journal and conference papers with two additional journal papers under review.


Saket Karajgikar

Saket Karajgikar has experience in developing thermal solutions at both data center level and at HW level. When he was working with Future Facilities, he assessed numerous data centers and provided recommendation to operate those efficiently. Later at Hyve Solutions, he managed team of thermal engineers while providing design inputs for compute and storage platforms. At Facebook, he is a lead engineer bridging the gap between HW design team and Data Center Solutions to ensure efficient and reliable operations of Facebook’s fleet of servers. Before joining industry, he graduated from University of Texas at Arlington under supervision of Prof. Agonafer.




Dharmesh Jani

Dharmesh Jani ('DJ') has been an active member of OCP since 2012. DJ has over 20+ years of experience in various roles spanning engineering, product management, and business strategy. He started his career at Rockwell Science Center designing ultra-high speed circuits in CMOS, subsequently as a system designer he designed first terrestrial FEC based optical transmission system at Corvis Systems. As a product manager at Semtech, he introduced the world’s first coherent 100G MUX for ultra-long-haul transport systems. Prior to joining Facebook, DJ led the cloud transformation for the biggest business unit at Flex. He was instrumental in bringing Flex into OCP and via founding of CloudLabs team, building core competencies within Flex to launch a cloud business unit. In his current role at Facebook, he is responsible for leading OCP and other open technologies, working with stakeholders inside and outside Facebook. Earlier in his career, he held roles at Infinera and Intel among others listed above. DJ is based out of Menlo Park, CA and is looking forward to working with the OCP Community and leadership team to continue the drive towards more open infrastructure.


Archna Haylock

Archna Haylock has over 25 years of account executive experience delivering over-quota sales performance, leading team revenue growth and discovering new markets. She is passionate about people, relationships and making connections. Being results oriented and strongly adept at creating cross-brand solutions, Archna has been assisting customers scale to global presence and helping them expand to new markets. She has been involved in creative solution design for "Internet of Things" applications and service-related solutions for Enterprise, Medical and Consumer industries. With over 15 years at IBM, she was a strong proponent that our customers' success is predicated on stellar sales service, their brand depends on it and they depend on our team. This personal philosophy led her to the Open Compute Project (OCP) Foundation. At OCP, scalability, growth, impact and efficiency are the key tenets which OCP solutions follow. Scalable designs across geographies and open source collaboration provide faster results for challenges faced by multiple industries. These open source hardware and software solutions will have a tremendous impact on the way we design, develop, create and address these challenges.


Rob Coyle

Rob Coyle — PCX Corporation's Director of Sales and Marketing — oversees the customer’s journey at PCX and works to remove friction from the client’s problem-solving process. Coyle’s sales experience includes electrical switchgear and emergency backup power systems for the data center market. He has several years of experience as an application engineer, where he sold and managed the implementation of emergency power systems akin to UPS Systems, electrical switchgear, automatic transfer switches and generators. Coyle holds Bachelors’ degrees in Applied Science in Aeronautics, Aviation and Aerospace Science Technologies from Southern Illinois University. He is also a certified commercial multi-engine pilot, as well as a certified maintenance technician for airframe and powerplant systems.



Caleb Lusk

Caleb Lusk, PMP is an Engineering Systems Consultant with Rittal, the world's leading manufacturer of industrial and IT enclosures. He has over 19 years of experience in design, enclosure manufacturing and project management with the company. Caleb holds a Mechanical Engineering degree and is a certified Project Management Professional (PMP). He is also an active member of the Open Compute Project serving as a Project Lead for the Rack and Power group. With his direct involvement, across global Rittal engineering teams, Caleb has helped to produced innovative designs for rack enclosures and liquid cooling solutions for both data center and industrial environments. He has a strong customer focus with an entrepreneurial spirit and is helping define next generation data centers.



Bapi Vinnakota

Bapi Vinnakota is a System Architect with Broadcom. After a Ph.D. at Princeton, he taught at the University of Minnesota, where he received an NSF CAREER and IBM Faculty Development Awards. He joined Intel through an acquisition and was an architect of a VoIP flow processor, worked in networking technology and incubated a networking SaaS product. At Netronome, he created and ran, a service for research in networking. He leads the Open Domain-Specific Architecture sub-project, in the Open Compute Project. The ODSA has active volunteers from over 30 companies and aims to define an open chiplet marketplace.