Video: Heterogenous Integration Challenges & Opportunities Panel

Moderators:

• Dr Gamal Refai-Ahmed, PhD, LFASME, FCAE, PEng (Ont), Xilinx Fellow and Chief Thermo- Mechanical Architecture
• Dr Leila Choobineh, PhD, Assistant Professor, SUNY Polytechnic Institute

Panelists:

• Prof Bahgat Sammakia, PhD, FASME, FIEEE, FNAT, Vice President of Research, Binghamton University
• Prof Amr Helmy, PhD, Professor University of Toronto
• Dr Ravi Mahajan, PhD, FASME, FIEEE, Intel Fellow (Tech Vice President)
• Dr Suresh Ramalingam, PhD, Xilinx Fellow(Tech Vice President)

 

This panel was conducted to address one of the HIR objectives on How as AMSE/IEEE Thermo-Mechanical& Packaging community can develop roadmap/technology options without compromising IP and without bias?

The panelists addressed the following areas:

• Is industry leading or misleading the PKG roadmap based on interface standards?
• Roadmap Fairness to different technologies
• Can Roadmap Provision the Future?
• Can Roadmap build on research with misalignment with Si manufacturability and architecture?
• Can academia produce a valuable proposition to the industry?