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InterPACK® 2023
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
In-Person Event
Doubletree by Hilton San Diego Mission Valley, San Diego, CA
October 24–26, 2023

Important Dates

  • Mar
    06
    March 06, 2023
    Abstract Submission
  • Mar
    13
    March 13, 2023
    Notification of Abstract Acceptance
  • May
    15
    May 15, 2023
    Submission of Full-length Draft Paper for Review / Electronic Copyright Process Opens
  • Jun
    05
    June 05, 2023
    Paper Review Complete
  • Jun
    12
    June 12, 2023
    Paper Acceptance Notification
  • Jun
    19
    June 19, 2023
    Submission of Revised Paper for Review (if required)
  • Jun
    26
    June 26, 2023
    Submission of Poster Abstracts
  • Jun
    26
    June 26, 2023
    Author Notification of Acceptance of Revised Papers
  • Jul
    12
    July 12, 2023
    Submission of Presentation Only and Poster Abstracts
  • Jul
    14
    July 14, 2023
    Submission of Copyright Form
  • Jul
    17
    July 17, 2023
    Author Registration
  • Jul
    17
    July 17, 2023
    Author Notification of Acceptance of Presentation Only and Poster Abstracts
  • Jul
    24
    July 24, 2023
    Final Paper Submission

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