ASME 2023 Student Hackathon
Background
The Computer & Information in Engineering (CIE) Division of the American Society of Mechanical Engineers (ASME) held past hackathon events at the IDETC/CIE 2020, 2021, 2022 Conferences. These hackathon events provide students and engineering practitioners with a unique opportunity to learn how data science and machine learning techniques can be leveraged to solve real-world engineering problems.
Given the previous resounding successes, the CIE Division will hold the ASME-CIE Hackathon again at the IDETC/CIE 2023 Conference in hybrid settings, both virtual and on-site, as a pre-conference event from Aug. 13-20, 2023.
Boston Park Plaza, Boston MA
August 13 -20, 2023 virtually and August 20, 2023 in person
in conjunction with
ASME IDETC/CIE 2023 Conference (August 20 - 23, 2023 in person)
Sponsored by
ASME Computers & Information in Engineering Division (CIE)
Autodesk
National Institute of Standards and Technology
and
Sandia National Laboratories
- $50 registration fee per participant for the Hackathon event (either as a conference add-on or stand-alone).
- This will be a hybrid event, both virtual and on-site. If unable to attend in person, please email us at idetccie.seikm@gmail.com so we can connect with you virtually.
- Participants are not limited to the number of problems chosen.
Important Dates
August 8, 2023, 11:59 pm EDT: Registration Deadline
August 13, 2023, 12 – 3 pm EDT: Virtual Hackathon Kick-off
August 20, 2023: Hybrid Hackathon Closing
August 20, 2023, 6 am EDT: due for Hackathon Deliverables
August 20, 2023, 9 am – 1 pm EDT: Final Presentations
August 20, 2023, 1 – 3 pm EDT: Hackathon Judging
August 20, 2023, 4 – 6 pm EDT: Closing Ceremony
* By registering for the Hackathon, you agree to allow your information to be shared with other registrants and volunteer leaders for the purpose of communicating event information and intra team communication.
Travel Awards
Depending on funding availability, we expect a limited number of travel awards to attend the ASME IDETC/CIE 2023 Hackathon event. The deadline to submit your travel award applications is August 1, 2023. Announcements regarding the travel awards will be made by July 15, 2023. If you have any questions, email idetccie.seikm@gmail.com. Awardees will be chosen by the hackathon committee from the pool of participants. Factors such as affiliation, status, conference attendance will be taken into consideration by the committee in awarding applications.
Participants who would like to apply for the travel award/fee waiver: Please fill out application forms at the following link before the hackathon registration deadline (August 1, 2023). The travel award ($150) is only considered for in-person/on-site participants, and the fee waiver ($50) is only considered for virtual participants. Announcements will be made to awardees via emails in the week of August 7-11, 2023.
Travel Award Application
Agenda
Please find the Hackathon Agenda here.
Award Information
For each problem:
- First Prize: $1,400
- Second Prize: $700
- Third Prize: $350
Notes: Teams will be judged in each problem topic area, and awardees will be selected separately.
Eligibility
Undergraduate students, graduate students, postdocs, and non-students (e.g. professionals) are welcome to attend the Hackathon and experience the exciting competitions.
Abstract
Autodesk (Technical Problem #1): In the world of CAD design, well-established best practices guide the creation of intricate models. However, the process of material selection introduces complexities that can lead to potential design revisions and time wastage. Material selection presents a real-world conundrum, as multiple viable solutions often exist for a single shape. The ultimate challenge lies in developing a tool that provides rational suggestions, empowering designers to make informed choices in their creative processes.
This hackathon takes on a crucial mission: to train an algorithm using CAD models sourced from the Fusion Gallery (or a dataset of your choosing) to identify suitable materials based on CAD geometries, thereby expediting the design-to-make cycle. Teams will be tasked with presenting and testing their solutions against ten withheld assemblies with defined ground truths. We invite all participants to join us in this pioneering endeavor, aiming to address the intricacies of material selection in CAD design.
Sandia (Technical Problem #2): It is well-known that materials, specifically metals and alloys, exhibit a multi-scale behavior. In this problem, we focus on the mesoscale and macroscale of an arbitrary solid object that can be modeled through computer-aid design (CAD) software. Participants are asked to enrich simple CAD objects with microstructure at the mesoscale level, using a microstructure dataset generated from SPPARKS (https://spparks.sandia.gov, https://spparks.github.io/). The problem can be thought of as synthesizing texture for an arbitrary solid CAD object.
Hackathon Team and Presentation
- All participants must be registered by August 1, 2023 11:59 pm EDT. Everyone will be placed in a team up of 1-2 members. You may form a team based on your own preference. All implementations must be based on the original work.
- Each Hackathon team will continue their own meetings via their own chosen platform between 08/13/23 and 08/20/23.
- Each team needs to present their teamwork including the technical approach and submit the results to their own GitHub repository by the submission deadline.
- Team final presentation, results, and technical approaches will be evaluated based on a technical committee (separated with the Hackathon organizing committee).
Hackathon Organizers
Dr. Anh Tran (Sandia National Laboratories) (chair), anhtran@sandia.gov
Prof. Zhenghui Sha (University of Texas – Austin), zsha@austin.utxas.edu
Prof. Hyunwoong Ko (Arizona State University), hyunwoong.ko@asu.edu
Dr. Zhuo Yang (Georgetown University, National Institute of Standards and Technologies), zy253@georgetown.edu
Prof. Dehao Liu (Binghamton University) dehaoliu@binghamton.edu
Dr. Yan Lu (National Institute of Standards and Technologies), yan.lu@nist.gov